Epcos Ag

Tdk Electronics Ag

Ernst Christl

Hans Krueger

Alois Stelzl

Gregor Feiertag

Hans KRÜGER

A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

Method for hermetically encapsulating a component

For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.

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Vilsbiburg, Germany

Ernst Christl