Sensata Technologies, Inc.

Ernie Johannus Antonius Schoot Uiterkamp

Frank Hendri Jacobs

Dedde Hedzer Wiersma

Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

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Heeten, Netherlands

Ernie Johannus Antonius Schoot Uiterkamp