Multiplanar Technologies Incorporated

Ernesto Saldana

Jun Liu

Jiro Kajiwara

Gerard Moloney

Alejandro Reyes

Cormac Walsh

Junsheng Yang

A polishing apparatus () is provided for polishing a substrate () that has slurry distributor () which improves planarization uniformity. Generally, the apparatus () includes: (i) a platen () with a polishing surface (); (ii) a head () adapted to hold the substrate () against the polishing surface; (iii) a mechanism to rotate the platen () during polishing; (iv) a dispenser () having nozzles () to dispense slurry on the surface (); and (v) a distributor () between the nozzles () and the head (). In one embodiment, the apparatus () further includes a wiper () between the head () and the distributor () to remove used slurry and polishing byproducts from the surface (), thereby reducing agglomerations or deposits that can damage the substrate () and improving yield. Optionally, the apparatus () further includes a dispenser () for dispensing a cleaning fluid before and/or after the wiper () to substantially eliminate buildup of deposits.

Growing community of inventors

San Jose, CA, United States of America

Ernesto Saldana