General Electric Company

Lockheed Martin Corporation

Ernest Wayne Balch

Leonard Richard Douglas

Robert J Wojnarowski

Kevin Matthew Durocher

Thomas Bert Gorczyca

James Wilson Rose

Richard J Saia

Ronald Frank Kolc

Herbert S Cole

Raymond Albert Fillion

Christopher James Kapusta

Donald Franklin Foust

Glenn Scott Claydon

Eladio Clemente Delgado

Michael Gdula

Vikram Bidare Krishnamurthy

Evan Taylor Downey

Paul Alan McConnelee

Stephen Daley Arthur

William Edward Burdick, Jr

Richard Alfred Beaupre

Min-Yi Shih

Tami Janene Faircloth

William Francis Nealon

Bernard Patrick Bewlay

Jie Jerry Liu

Anil Raj Duggal

Mark Gilbert Benz

Bin Wei

Stanton Earl Weaver, Jr

Dale M Brown

Renato Guida

Thomas Robert Raber

Andrew Lee Trimmer

Samhita Dasgupta

Colin Richard Wilson

Bernard Gorowitz

Christian Maria Anton Heller

Paul Andrew Frank

Larry Gene Turner

Joseph M Pimbley

Hak Fei Poon

Kenneth J Polasko

Stacey Joy Goodwin

Yoav Nissan-Cohen

William H King

A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.

Power semiconductor module and fabrication method

Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.

Large-area lighting systems and methods of making the same

A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.

Method of making an electronic device cooling system

A focal track region of an x-ray anode in an example is electrochemically etched. In a further example, an x-ray anode comprises a thermally-compliant focal track region for impingement of electrons from an x-ray cathode to create an x-ray source. The thermally-compliant focal track region comprises a pattern of discrete relative expanses and gaps.

X-ray anode focal track region

A method for adaptively fabricating a waveguide comprises: measuring misplacement of a photonic device relative to a substrate; generating computer readable instructions for using a plurality of graphics primitives to form the waveguide; and photocomposing the waveguide on the substrate in accordance with the computer readable instructions. A reticle comprises a plurality of graphics primitives with at least one of the plurality of graphics primitives comprising a tapered end. A waveguide comprises a plurality of waveguide segments with each of the plurality of waveguide segments comprising a tapered end and being adjacent to at least one other of the plurality of waveguide segments.

Waveguide including a plurality of waveguide segments

A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.

Series connected OLED structure and fabrication method

Method and apparatus for fabricating waveguides and waveguides fabricated therefrom

A microvalve and a method of forming a diaphragm stop for a microvalve. The microvalve includes a first layer and a diaphragm member to control the flow of fluid through the microvalve. The method comprises the step of forming a contoured shaped recess extending inward from a surface of the layer by using a laser to remove material in a series of areas, at successively greater depths extending inward from said surface. Preferably, the recess has a dome shape, and may be formed by a direct-write laser operated via a computer aided drawing program running on a computer. For example, CAD artwork files, comprising a set of concentric polygons approximating circles, may be generated to create the dome structure. The laser ablation depth can be controlled by modifying the offset step distance of the polygons and equating certain line widths to an equivalent laser tool definition. Preferably, the laser tool definition is combined with the CAD artwork, which defines a laser path such that the resulting geometry has no sharp edges that could cause the diaphragm of the valve to tear or rupture.

Method for protecting the diaphragm and extending the life of SiC and/or Si MEMS microvalves

An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Optoelectronic package and fabrication method

There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

Plastic packaging of LED arrays

A method for interconnecting high-temperature silicon carbide (SiC) devices enables such high-temperature devices to be used in fabricating electronic circuits of significant scale. This method comprises empirically measuring operational characteristics of a plurality of the devices to be interconnected, the operational characteristics comprising devices which are measured to be non-working and devices which are measured to be working; characterizing the operational characteristics in an operational characteristics map; designing interconnection paths between and among the devices that are characterized to be working by the operational characteristics map; and excluding from the interconnection paths, devices that are characterized to be non-working by the operational characteristics map. A preferred embodiment of this method further includes disposing a temporary polymer layer over the devices; forming via holes through the temporary polymer layer, to bonding pads of the devices; applying a current-balancing resistive metal over the temporary polymer layer; establishing connections between the current-balancing resistive metal and the bonding pads; designing the interconnection paths between and among the working devices by patterning the current-balancing resistive metal based on the operational characteristics map; and removing the temporary polymer layer.

High temperature circuit apparatus

Growing community of inventors

Ballston Spa, NY, United States of America

Ernest Wayne Balch