International Business Machines Corporation

Ernest N Urfer

George E Melvin

Stephen A Milkovich

Richard J Hetherington

Kamalesh S Desai

Raymond L Ricci

Carl L Eggerding

Walter W Koste

John A Ferrante

A process and a solid plane structure for minimizing delamination during sintering in the fabrication of multi-layer ceramic substrates, wherein the solid plane structure is designed to obtain maximum ceramic to ceramic interface contact.

Process and structure for minimizing delamination in the fabrication of

A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.

Method of fabricating an improved multi-layer ceramic substrate

An improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.

Multi-layer ceramic substrate

A ceramic green sheet material is metallized by laminating a thin organic material, preferably MYLAR, to a ceramic green sheet surface, and then employing an electron beam to define a predetermined pattern of openings extending through the organic material and selectively into and through the green sheet. The resulting channels and via holes are then filled with a metal paste. The organic mask is removed by peeling subsequent to the metal paste deposition step.

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Hopewell Junction, NY, United States of America

Ernest N Urfer