Other

Macdermid Enthone Gmbh

Macdermid, Incorporated

Macdermid Acumen, Inc.

Ernest Long

Steven A Castaldi

Robert M Hamilton

Lei Jin

Andrew M Krol

Lev Taytsas

Richard A Bellemare

Fengting Xu

Jean W Chevalier

Michael M Ryl

William J Decesare

John F Swanson

James Watkowski

Donna Kologe

Donna M Kologe

Lenora M Toscano

Carl P Steinecker

Colleen Mckirryher

Carmichael Gugliotti

Ron Blake

Adam Letize

Donald Desalvo

Cherry S Santos

Tyler Banker

Paul Romaine

Witold Paw

Alexander Konefal

Wei Yan

Keisuke Nishu

Katsutsugu Koyasu

Robert Hamilton

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate: and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating, DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

Complex waveform for electrolytic plating

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Silver/tin electroplating bath and method of using the same

Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, HS. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

Elimination of H2S in immersion tin plating solution

A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Method for improving plating on non-conductive substrates

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, R, and Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by a polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.

Method of producing polymeric phenazonium compounds

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts as NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, and wherein R&#x2014;N&#x2014;Rrepresents a substituted amine, and Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Rwith its substituent group is a substituted amine, with Rand Rrepresenting any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.

Surface treatment of silicon

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

Method for enhancing the solderability of a surface

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Burlington, CT, United States of America

Ernest Long