Bystronic Laser Ag

Ernest Imboden

Daniel Cathry

David Broger

Thierry Perrin

Tobias Bugmann

Christoph Rychard

Perrin Thierry

A marking system configured for marking a metallic workpiece is provided. The marking system includes an interface configured to receive information about parts to be cut out of the workpiece. A marking unit is movable over a processing area configured to receive the workpiece. The marking unit is configured to provide parts to be cut with a marking identifying the respective part to be cut before the cutting process from the workpiece.

Marking system and laser cutting machine

Laser processing machines, such as laser cutting machine, including a work table receiving workpiece, and work arm with a laser cutting head. Laser cutting head includes nozzle receiving device and nozzle. Via nozzle laser beam may be directed onto work piece. Machine includes main drives moving work arm and/or the laser cutting head on X-Y-Z axes to process work piece, as well as an alignment unit to adjust laser beam. An adjusting station includes receiving unit fixing nozzle and/or the nozzle receiving device during centering of nozzle. The alignment unit has head element in laser cutting head. Head element receives nozzle and/or the nozzle receiving device and is slidable in X-Y directions, via the main drives. Head element may be fixed in a selected position, within the laser cutting head, via clamping device releasable during nozzle centering at adjusting station.

Laser processing machine

Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm () with a laser cutting head (). Laser cutting head () includes nozzle receiving device () and nozzle (D). Via nozzle (D) laser beam () may be directed onto work piece (W). Machine (LM) includes main drives moving work arm () and/or the laser cutting head () on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (). An adjusting station () includes receiving unit () fixing nozzle (D) and/or the nozzle receiving device () during centering of nozzle (D). The alignment unit has head element (B) in laser cutting head (). Head element (B) receives nozzle (D) and/or the nozzle receiving device () and is slidable in X-Y directions, via the main drives. Head element (B) may be fixed in a selected position, within the laser cutting head (), via clamping device () releasable during nozzle centering at adjusting station ().

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Steinhof, Switzerland

Ernest Imboden