Thermal Corporation

Ernest H Dubble

Richard M DeKeuster

Jonathan P Wattelet

Michael J Wilson

Donald Lightner

Gregg J Baldassarre

Jon Zuo

Donald M Ernst

A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Liquid cooled heat sink with cold plate retention mechanism

A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.

Modular heat sink

Growing community of inventors

Lancaster, PA, United States of America

Ernest H Dubble