Crane Electronics, Inc.

Ernest Clyde Parker

Philip Joseph Lauriello

Anton Zlatev

Dongmin Liu

Michael Robert Pierce

James William White

Randall Stephenson

Fan Wang

David L Wiley

A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.

Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module

Systems and methods that allow for weight and size reduction of electronics components, such as transformer rectifier units (TRUs) or autotransformer rectifier units (ATRUs), by providing a fluid cooling system is utilized to provide high heat dissipation for a transformer assembly of TRUs or ATRUs by providing a thermal interface at the windings of the transformer assembly, which are the hottest spots in such assemblies. The cooling system may include a fluid-cooled winding heat sink element or 'finger,' which may be a thermally conductive bar (e.g., aluminum, copper) having microchannels therein positioned between the core and windings of a transformer or between turns of the windings of a transformer. Fluid passes through the microchannels of the heat sink element to provide direct cooling to the heat generating windings of the transformers. The heat sink element may be produced by an additive manufacturing technology.

Transformer-based power converters with 3D printed microchannel heat sink

This disclosure describes systems, methods and articles of a passive EMI filter integrated with an active boost converter for low-side line transients and/or an active clipper for high-side line transients. During steady-state operation, the active circuitry is disabled so the circuit functions as a passive EMI filter. Inductive and capacitive components used in the passive EMI filter during steady-state operation may serve a dual role and become part of a boost converter when input voltage is below a low-line steady-state and, in some variations, the inductive and capacitive components may become part of a transient clipper when the input voltage is above a high-line steady-state level. The transient clipper may be implemented as a linear pass element or as a switch-mode converter (e.g., buck converter).

Integrated tri-state electromagnetic interference filter and line conditioning module

A power architecture receives an input signal at an input node and converts the input signal into an intermediate signal with a power conversion stage. The power conversion stage supplies the intermediate signal to an output node of the power conversion stage where the intermediate signal is filtered with an operating capacitance coupled to the output node. A hold-up capacitance is charged, and when a loss of the input signal is detected, the hold-up capacitance is coupled to the input node.

Growing community of inventors

Mill Creek, WA, United States of America

Ernest Clyde Parker