Micron Technology Incorporated

Ernest C Nichols

Leo L Malmin, Jr

John S Molebash

Timothy A Strodtbeck

Shelby K Moore

Kevin A Larsen

Brian D Brown

An adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Adjustable wafer transfer machine

A wafer lift for lifting a series of vertically oriented wafers arranged parallel to one another in a cassette. The wafer lift includes a vertically movable ramp and a cassette guide positioned over the ramp. The ramp is raised to engage wafers in a cassette supported on the guide so that each wafer is lifted incrementally higher than the preceding wafer.

Manual wafer lift

A semiconductor wafer transfer machine for transferring first wafers having a first diameter from a first transferor carrier to a first receiver carrier and second wafers having a second diameter different from the first diameter from a second transferor carrier to a second receiver carrier. The wafer transfer machine includes a base plate with a longitudinal axis for placement on the base plate of the transferor carriers and the receiver carriers and a mechanism for transferring wafers contained in the first and second transferor carriers to the first and second receiver carriers, respectively. The wafer transfer machine also includes an adjustable positioner that comprises (1) a transferor positioning mechanism for aligning the first and second transferor carriers on the top surface of the base plate, (2) a first receiver positioning mechanism for aligning the first receiver carrier in a first position with respect to the first transferor carrier on the top surface of the base plate, and (3) a second receiver positioning mechanism for aligning the second receiver carrier in a second position with respect to the second transferor carrier on the top surface of the base plate.

Convertible wafer transfer machine

A wafer lift for lifting a series of vertically oriented wafers arranged parallel to one another in a cassette. The wafer lift comprises a lift plate and an actuator mechanism for raising the lift plate. The lift plate has a contact surface for engaging the edge of each of the wafers. The contact surface extends upward at a predetermined angle so that, when the lift plate is raised and the contact surface engages the edges of the wafers, each wafer is lifted incrementally higher than the preceding wafer. The actuator mechanism includes a bell crank rotatable about a pivotal axis for transforming rotational motion into translational motion. The bell crank has first and second crank arms that extend radially from the pivotal axis and an arcuate member that extends circumferentially between and joining the crank arms. Thus, the arcuate member forms the circumferential perimeter of the bell crank. The actuator mechanism also includes a transmission mechanism for transmitting the translational motion of the perimeter of the bell crank to the lift plate to raise the lift plate so that the contact surface engages the edges of the wafers. The transmission mechanism consists of a lift belt linking the bell crank and the lift plates. One end of the lift belt is attached to the perimeter of the bell crank and the other end is operatively connected to the lift plate for vertical movement therewith. The lift belt runs under a first roller and over a second roller. The belt has a first segment between the bell crank and the first roller, a second segment between the first and second rollers, and a third segment between the second roller and the lift plate. The rollers are configured so that rotation of the bell crank about its pivotal axis pulls the first segment of the belt upward, the second segment downward and the third segment upward to raise the lift plate to engage and lift the wafers.

The invention provides a manually operated machine for radially aligning one or more semiconductor wafers. The machine includes an elongated first 'notch' roller for rotatably engaging the edge of the wafers, a gear train, and a hand crank for manually rotating the first roller in cooperation with the gear train. The wafers are aligned according to the notches as the wafers are engaged and rotated by the notch roller until the notch in each wafer falls over and is disengaged by that roller. The manual notch finder may also include an elongated second 'position' roller for rotatably engaging the edge of the wafers. The position roller is disposed laterally near the notch roller and sized and shaped to engage the edge of the wafers fully along the periphery of each wafer so that the aligned wafers can be positioned to any degree of radial orientation. The invention also provides a combination notch or flat finder machine integrated with a wafer transfer machine. The combination machine includes a base plate, a translatable transfer arm, and a notch finder machine such as that described above, or a flat finder machine.

Notch finder and combination wafer transfer machine

A adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

A water lift for lifting a series of vertically oriented wafers arranged parallel to one another in a cassette. The wafer lift comprises a lift plate and an actuator mechanism for raising the lift plate. The lift plate has a contact surface for engaging the edge of each of the wafers. The a contact surface extends upward at a predetermined angle so that, when the lift plate is raised and contact surface engages the edges of the wafers, each wafer is lifted incrementally higher than the preceding wafer. The actuator mechanism includes a bell crank rotatable about a pivotal axis for transforming rotational motion into translational motion. The bell crank has first and second crank arms that extend radially from the pivotal axis and an arcuate member that extends circumferentially between and joining the crank arms. Thus, the arcuate member forms the circumferential perimeter of the bell crank. The actuator mechanism also includes a transmission mechanism for transmitting the translational motion of the perimeter of the bell crank to the lift plate to raise the lift plate so that the contact surface engages the edges of the wafers. The transmission mechanism consists of a lift belt linking the bell crank and the lift plates. One end of the lift belt is attached to the perimeter of the bell crank and the other end is operatively connected to the lift plate for vertical movement therewith. The lift belt runs under a first roller and over a second roller. The belt has a first segment between the bell crank and the first roller, a second segment between the first and second rollers, and a third segment between the second roller and the lift plate. The rollers are configured so that rotation of the bell crank about its pivotal axis pulls the first segment of the belt upward, the second segment downward and the third segment upward to raise the lift plate to engage and lift the wafers.

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Boise, ID, United States of America

Ernest C Nichols