Intel Corporation

Erkan Acar

Joe F Walczyk

Jin Yang

Justin Michael Huttula

Mohanraj Prabhugoud

Jin Pan

Ronald Michael Kirby

Youngseok Oh

Pooya Tadayon

Todd P Albertson

Ethan Caughey

Stephen Sturges

Armen Y Balian

A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

Micro-coaxial wire interconnect architecture

A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.

Shielded interconnect array

A test apparatus and method of testing a DUT are described. The apparatus includes a receiver and transmitter path each having a pair of switches that switch between a bypass position and a direct position. The bypass position is used for low frequency signals communicated through the apparatus. The direct position allows higher frequency signals to be double converted by upconversion to an IF signal and bandpass filtered before being downconverted to a predetermined frequency. Both variable and fixed LO signals are used to convert the double converted signals so that the same IF may be used independent of the higher frequency signal received or transmitted. Bandpass filtering is applied before and after amplification of the IF signal. Lowpass filtering before and after the double conversion use LPFs of different cutoff frequencies.

High density low cost wideband production RF test instrument architecture

A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

Microelectronic test device including a probe card having an interposer

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

Space transformation methods

Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to couple the space transformer to the carrier. The assembly also includes a probe array positioned on the space transformer, wherein the space transformer is positioned between the probe array and the carrier. The assembly also includes a printed circuit board, wherein the carrier is positioned between the printed circuit board and the space transformer. The assembly also includes electrical connections to electrically couple the space transformer to the printed circuit board. Other embodiments are described and claimed.

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Hillsboro, OR, United States of America

Erkan Acar