Siemens Aktiengesellschaft

Siemens Healthineers Ag

Erik Weisbrod

Stefan Stegmeier

Jörg Zapf

Markus Pfeifer

Albrecht Donat

Axel Ganster

Martin Seifert

Markus Lasch

Caroline Cassignol

Felix Zeyss

Franziska Lambrecht

Roland Lorz

Ronny Werner

Hubert Baueregger

Michael Ott

Oliver Raab

Alexander Hensel

Dulijano Pecanac

An arrangement for a semiconductor arrangement includes a substrate including a dielectric material layer and a first metallization arranged on the dielectric material layer. A passive component is arranged completely in a cutout of the first metallization and bears directly on the dielectric material layer. The passive component is designed to include a first profile. The the first metallization includes a second profile in a region of contacting with the passive component, with the first and second profiles engaging with one another.

Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate

Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.

Method for producing conductive tracks, and electronic module

Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

Electronic module, method for producing an electronic module, and industrial plant

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Munich, Germany

Erik Weisbrod