General Electric Company

Other

Erik W Walles

John H Lupinski

James V Crivello

Patricia Chapman Irwin

Robert Edgar Colborn

John E Hallgren

Donald A Bolon

Mark Markovitz

Michael G Minnick

Michael John Davis

Victoria J Eddy

James R Presley

Steven J Kubisen, Jr

Bobby A Howell

Sterling B Brown

Tohru Takekoshi

Andrew J Caruso

Choong Y Han

Compatible compositions comprising polyarylene sulfide-polyphenylene ether copolymers are prepared by the reaction of a polyphenylene ether containing epoxy groups, typically an epoxytriazine-capped polyphenylene ether, with a polyarylene sulfide containing epoxide-reactive functional groups, preferably amine groups. It is sometimes advantageous to anneal said compositions or molded articles prepared therefrom.

Polyphenylene ether-polyarylene sulfide compositions

Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Fibers impregnated with epoxy resin mixture, brominated bisphenol and

A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Microencapsulation method, microelectronic devices made therefrom, and

A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Encapsulation method, microelectronic devices made therefrom, and heat

Printed circuit board from fibers impregnated with epoxy resin mixture,

Curable polyphenylene ether-polyepoxide compositions useful in printed

Method of encapsulating electronic devices

Novel complexes are prepared from water-soluble compounds having at least one amidocarbonylic unit and a square planar organometallic compound.

Macromolecular complexes of amidocarbonylic water-soluble polymers and

Unique, valuable and multifariously utile macromolecular complexes are comprised of: (i) non-ionic, amidocarbonylic, water-soluble polymers (and, for some embodimental purposes, the monomeric precursor(s) thereof), including such known materials as (poly)N-vinylpyrrolidone (i.e., 'PVP') and/or (poly)N-vinyl-5-methyl-2-oxazolidinone (i.e., 'PVO-M') and the hereinafter disclosed like(s) and/or equivalent(s) thereof which, for convenience, may be herein generically identified as 'WSP'; and (ii) square planar configured platinous and, for instant applicancy, equivalently metalled organometallic compounds characterized in containing in ligandal inclusion an aromatic moiety from which depends and to which is connected at least a single distinctly polar substituent group (or 'handle', as it were), such as an hydroxide (i.e., '--OH'), carboxylic acid (i.e., '--COOH') or sulfonic acid - (i.e., '--SO.sub.3 H') unit and/or equivalents thereof as herein disclosed which, for convenience, may for generic identification be herein called an 'SPOM'. The WSP:SPOM complex(es) are associated by non-ionic or other bonding attachment in the nature of hydrogen bonding and/or closely related electrostatic interaction between or through and to the polar substituent in the SPOM and the amidocarbonylic unit in the WSP.

Growing community of inventors

Rensselaer, NY, United States of America

Erik W Walles