Robert Bosch

Erik Sueske

Gustav Klett

Ulrich Graf

Peter Tauber

Steffen Orso

Gerhard Braun

Eckart Geinitz

Thomas Suenner

Tuncay Sentuerk

Juergen Zipprich

Christian Schiele

Andreas Krutsch

Daniel Michels

Manuela Rapp

Bjoern Jakob Mueller

Manuela Keil

Alexander Baer

Benjamin Metais

Uta Kienzle

A composite assembly of three stacked joining partners, and a corresponding method. The three stacked joining partners are materially bonded to one another by an upper solder layer and a lower solder layer. An upper joining partner and a lower joining partner are fixed in their height and have a specified distance from one another. The upper solder layer is fashioned from a first solder agent, having a first melt temperature, between the upper joining partner and a middle joining partner. The second solder layer is fashioned from a second solder agent, having a higher, second melt temperature, between the middle joining partner and the lower joining partner. The upper joining partner has an upwardly open solder compensating opening filled with the first solder agent, from which, to fill the gap between the upper joining partner and the middle joining partner, the first solder agent subsequently flows into the gap.

Composite assembly of three stacked joining partners

The invention relates to a method for making contact with a semiconductor (), and to a contact arrangement () for a semiconductor (), wherein the semiconductor () is a really connected to a first contact partner () at at least one first area by the formation of a first soldering layer () having a predefined thickness. According to the invention, a polyimide layer () is applied as delimiting means on the semiconductor (), said polyimide layer predefining the dimensions and/or the form of at least one soldering area () of the semiconductor ().

Method for making contact with a semiconductor and contact arrangement for a semiconductor

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Reutlingen, Germany

Erik Sueske