Rec Solar Pte. Ltd.

Plant Pv, Inc.

Hitachi Chemical Company, Ltd.

Universitetet I Oslo

Rec Scan Wafer As

Renewable Energy Corporation Asa

Instititt for Energiteknikk

Cenate As

Rec Wafer Pte. Ltd.

Sunphase As

Erik Sauar

Stephen T Connor

Brian E Hardin

Craig H Peters

Daniel J Hellebusch

Dhea Suseno

Jesse J Hinricher

Jennifer Huang

Tom Yu-Tang Lin

Andreas Bentzen

Martin Kirkengen

Martin Nese

Paul Alan Basore

Alexander Ulyashin

Arve Holt

Lode Carnel

Egor Vladimirov

Stian Sannes

Mohan Menon

Oystein Holm

Bengt Svensson

Per Arne Wang

Tor Christian Tuv

Borge Bjorneklett

Anne Lohne

Oleg Fefelov

ØYstein Holm

Børge BJØRNEKLETT

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Print-on pastes for modifying material properties of metal particle layers

A rear contact heterojunction solar cell and a fabricating method. The solar cell comprises a silicon substrate having a passivating layer and an intrinsic amorphous silicon layer. At a back side of the intrinsic amorphous silicon layer, an emitter layer and a base layer are provided. Interposed between these emitter and base layers is a separation layer comprising an electrically insulating material. This separation layer as well as the base layer and emitter layer may be generated by vapor deposition. Due to such processing, adjacent regions of the emitter layer and the separating layer and adjacent regions of the base layer and the separating layer partially laterally overlap in overlapping areas in such a way that at least a part of the separating layer is located closer to the substrate than an overlapping portion of the respective one of the emitter layer and the base layer.

Solar cell and method for producing same

Fired multilayer stacks for use in integrated circuits and solar cells

A method is provided of fabricating a photo voltaic generator panel () including a polymer back sheet () with at least one attachment feature () so as to provide means of attaching the panel to a structural support () upon subsequent installation. At least one polymer attachment feature () is applied to the outer side of the polymer back sheet of the panel during the manufacturing process for the panel whereby the attachment feature projects with respect to the back sheet. The application may be in conjunction with a lamination process, or subsequent to the lamination process, or as an integral part of the back sheet manufacturing process. The attachment feature is adapted to engage with a corresponding feature () or features to be found on a support structure () located at a site for the installation of the panel. The said at least one polymer attachment feature and said outer side of the polymer back sheet have a similar thermal expansion coefficient.

Photo voltaic generator panel, method and system

This invention relates to a method for producing solar cells, and photovoltaic panels thereof. The method for producing solar panels comprises employing a number of semiconductor wafers and/or semiconductor sheets of films prefabricated to prepare them for back side metallization, which are placed and attached adjacent to each other and with their front side facing downwards onto the back side of the front glass, before subsequent processing that includes depositing at least one metal layer covering the entire front glass including the back side of the attached wafers/sheets of films. The metallic layer is then patterned/divided into electrically isolated contacts for each solar cell and into interconnections between adjacent solar cells.

Method for production of wafer based solar panels

A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.

Methods of forming solar cells with fired multilayer film stacks

Solar cells and modules with fired multilayer stacks

The surface recombination velocity of a silicon sample is reduced by deposition of a thin hydrogenated amorphous silicon or hydrogenated amorphous silicon carbide film, followed by deposition of a thin hydrogenated silicon nitride film. The surface recombination velocity is further decreased by a subsequent anneal. Silicon solar cell structures using this new method for efficient reduction of the surface recombination velocity is claimed.

Surface passivation of silicon based wafers

A method for reducing attraction forces between wafers () is provided. This method includes the step of, after sawing and before dissolution of the adhesive (), introducing spacers () between wafers (). A wafer singulation method and an agent for use in the method are also provided.

Reduction of attraction forces between silicon wafers

The invention regards a method and a system for establishing correspondence between wafers and solar cells produced from said wafers. The method comprises for each wafer and each solar cell, providing an image of the wafer, providing an image of the cell, comparing the wafer image to the cell image, upon match between a cell image and a wafer image, assigning the current cell to the current wafer. The system comprises at least one imaging device for providing images of the wafers and the cells, a processing unit for comparing a wafer image to a cell image, and upon match between a cell image and a wafer image, assigning the current cell to the current wafer, and a memory unit.

Establishing correspondence and traceability between wafers and solar cells

Growing community of inventors

Oslo, Norway

Erik Sauar