Mayo Foundation for Medical Education and Research

Hrl Laboratories, LLC

Erik S Daniel

Robert W Techentin

Peter David Brewer

Aurelio Lopez

Bart Owen McCoy

Daniel Schraufnagel

James H Schaffner

Keyvan R Sayyah

Guillermo A Herrera

Andrew C Keefe

Oleg M Efimov

Pamela R Patterson

Tahir Hussain

Raymond Sarkissian

Richard Michael Kremer

Brian N Limketkai

Michael John Degerstrom

Brent M Berry

Gary C Sieck

Soudabeh Kargar

Obaid Khurram

Joseph D Mozingo

Michal T Kucewicz

Partia Naghibi Mahmoudabadi

Carlos B Mantilla

A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together. In need be, the two can be separated at this stage for re-work After passing inspection, a relatively higher compressive force or pressure is applied between the two electronic devices to cause the standoff distance to decrease to zero and for the contact pads confronting each other on the confronting two electronic devices to weld thereby permanently bonding the two electronic devices together.

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Small pitch integrated knife edge temporary bonding microstructures

This document describes methods and devices for using electrical stimulation to control physiological functions such as breathing of patients suffering from respiratory impairment. For example, this document describes methods and devices for generating effective breaths and airway protection by determining times and depths of breaths in accordance with physiological demand, and coordinating respiratory muscle stimulation with the breaths to control breathing.

Systems and methods for controlling breathing

A continuous wave (CW) heterodyne light detection and ranging (LIDAR) air velocity sensor system that comprises a first light emitting structure arranged to send a signal light in a first direction in space; a second light emitting structure arranged to produce a local oscillator light having a wavelength different from the wavelength of the signal light by a predetermined wavelength; a receiver arranged to receive light from said first direction in space; and a first optical mixer for mixing the received light with said local oscillator light.

CW LIDAR wind velocity sensor for operation on a stratospheric vehicle

Zero sum signaling schemes utilize coding across data words to allow the use of single-ended buffers while mitigating simultaneous switching noise (SSN) in digital systems. Zero sum signaling may include balanced zero sum coding (target disparity=0) and nearly balanced zero sum coding (target disparity=&#xb1;d). Zero sum signaling may reduce simultaneous switching noise as compared to single-ended signaling while allowing a reduction in the number of physical channels (e.g. circuit board traces) by nearly a factor of two as compared to differential signaling.

Zero sum signaling in a digital system environment

Application of open and short structures may result in improved accuracy in determination of ABCD parameters of a substantially symmetric two-port network for purposes of bisect de-embedding. Either one or both of the open and/or short techniques may be used to improve results of an ABCD optimization algorithm. Bisect de-embedding may then be performed to determine the ABCD parameters of a device under test based on the ABCD parameters of the substantially symmetric two-port network and measured s-parameters of the substantially symmetric two-port network and the embedded device under test.

Application of open and/or short structures to bisect de-embedding

A transmission line on a printed wiring board is tested and printed wiring board manufacturing variability is assessed. A response of the transmission line to a signal test pattern is measured. A network including a plurality of components connected by the transmission line is then simulated. The simulated network is based on the measured scattering parameters and virtual models representative of each of the components in the network. A system-level output response of the simulated network to a simulated input signal is analyzed, and the printed wiring board is characterized based on a comparison of the system-level output response to a printed wiring board performance metric threshold.

Link analysis compliance and calibration verification for automated printed wiring board test systems

Techniques for bisecting a symmetric, substantially transmissive two-port network (a THRU structure) through an optimization solution of the relevant equations defined by transmission matrix mathematics are described. Bisect de-embedding may be performed using a single substantially symmetric THRU structure, a first half of a first substantially symmetric THRU structure and a second half of a second substantially symmetric THRU structure, and by combining bisect de-embedding with conventionally known de-embedding techniques.

Bisect de-embedding for network analyzer measurement

Growing community of inventors

Rochester, MN, United States of America

Erik S Daniel