The Boeing Company

Semitool, Inc.

Erik Lund

Steven L Peace

Kyle Moran Hanson

Gregory J Wilson

Daniel J Woodruff

Paul R McHugh

Gregory Lowman Branch

Thomas Jacob Hagman

Thomas C Stone

James P Dwyer

Jonathan Richard Schwedhelm

Wade Matthew Morris

Brian Edward Hood

Paul Zachary Wirth

William Thomas Kline

Scott Edward Krajca

Mark S Bunker

Nigel Stewart

Wade M Morris

Jonathan R Schwedhelm

Brian E Hood

Gregory L Branch

Thomas J Hagman

Darrell Darwin Jones

Eric J Bergman

Kurtis Shuldberg Willden

John Dempsey Morris

Joseph Warren

Dan Dresskell Day

Geoffrey Allen Butler

Jeremy Evan Justice

Garrett C Hanson

Silas Lawton Studley

Gabriel Zane Forston

Dana R Scranton

Bruce S Howard

Luis A Perla

Mark C Boberg

Charles Yuanxin Hu

Worm Lund

Long H Ly

Nicholas Boroughs

Thomas Joseph Kennedy

Chace Wilcoxson

Derek J Flolid

Matthew R Desjardien

Stephen Glade Holley

Thomas Dean Wilson

Michael Karas

Robert G Meyer

Benjamin Bowen Lee

Bruno Zbinden

Dalton C Bergan

Joseph Fount Warren, Jr

Gregory R Klempel

Matt Christner

Elise Rae Ermitano Castorina

Peter J VanVoast

Marko Oviir

Derek Willis

Charles J Nelson

Wade Morris

Daniel Smith

Richard A Ransom

Curtis M Groth

Thang D Phung

Eric J Walker

Justin L Holland

John D O'Connell

Blake Rafferty

John D O'CONNELL

Joseph F Warren

A system for fabricating a composite structure includes a ply carrier including a ply support surface configured to support at least one composite ply. The system includes a carrier transfer device configured to convey the ply carrier. The system includes a lamination system configured to selectively apply the at least one composite ply to the ply support surface of the ply carrier. The system includes a transfer system configured to remove the ply carrier from the carrier transfer device and to apply the at least one composite ply to at least a portion of a forming surface of a forming tool. The system includes a forming system configured to form the at least one composite ply over the at least a portion of the forming surface of the forming tool.

System and method for fabricating a composite structure

Systems and methods for forming radius fillers for composite structures are disclosed herein. The systems include a sheet-locating structure that has a support surface and a support surface edge. The systems further include a separation device, a conveyance structure, and a layup surface. The methods include locating a sheet of composite material on a first support surface and translating the sheet of composite material such that a first portion of the sheet is supported by the first support surface and a second portion of the sheet extends past the support surface edge. The methods also include separating the second portion of the sheet from the first portion of the sheet to form a strip of composite material. The methods further include conveying the strip of composite material onto a layup surface and repeating the methods to form the radius filler from a plurality of strips of composite material.

Systems and methods for forming radius fillers for composite structures

An apparatus for forming a material layer onto a form tool may include at least one nosepiece configured to laterally sweep a ply carrier onto a form tool contour. The apparatus may include a pair of tension arms configured to support opposing lateral sides of a ply carrier having a material layer mounted to a lower surface thereof. The apparatus may include one or more actuators configured to position the tension arms during forming of the ply carrier to the form tool contour. The one or more actuators may be configured to sense and control lateral tension in the ply carrier during forming of the ply carrier to the form tool contour.

Apparatus and method for automated layup of composite structures

Composite tape is laminated onto a substrate using a gantry to move a tape laminating head along the length of the substrate. The laminating head is mounted for movement along a beam on the gantry that extends across the width of the substrate. The direction of lamination may be altered by changing the angular orientation of the beam.

Apparatus for laminating composites

A method for forming a structural member and a structural member produced thereby includes positioning a first composite section and a second composite section within a tool. The tool has an inner surface and a wall intersection and is supported by a tool platform. The tool platform and a pressure platform are relatively movable between an open position and a closed position. The tool has a non-planar outer surface against which the member may be pressed. A composite splice member is positioned at least partially overlapping both the first composite section and the second composite section to form a joint in the composite structural member. The composite structural member is pressed against the non-planar outer surface of the tool by applying pressure to the joint from a pressure bladder. Heat is applied to the composite structural member at the joint to cure the composite splice member to the first composite section and the second composite section.

Aircraft skin attachment system

Methods for laminating composites

A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Electro-chemical processor

A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Multi-process system

A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.

Apparatus and methods for processing a workpiece

Growing community of inventors

Burien, WA, United States of America

Erik Lund