Honeywell International Inc.

Erik L Turner

Ira G Nolander

Stephane Ferrasse

Frank C Alford

Patrick K Underwood

David E Steele

Younes Sina

A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650&#xb0; C. to about 750&#xb0; C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500&#xb0; C. to about 650&#xb0; C. to form a copper alloy.

Method of forming copper alloy sputtering targets with refined shape and microstructure

Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.

High quality, void and inclusion free alloy wire

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Spokane, WA, United States of America

Erik L Turner