Kemet Electronics Corporation

Erik Karlsen Reed

Philip Michael Lessner

John Tony Kinard

Brian John Melody

David Alexander Wheeler

Randolph Stephen Hahn

Albert Kennedy Harrington

Chris Stolarski

David W Jacobs

Daniel Francis Persico

Liancai Ning

Qun Ya

Xincheng Jin

Yuri Freeman

Kimberly Lynn Pritchard

Jothi Rajasekaran

James Charles Marshall

Jonathan Paulsen

Duane Earl Stenziner

An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.

Vertical stack approach in low profile aluminum solid electrolytic capacitors

Stack capacitor having high volumetric efficiency

A method for screening electrolytic capacitors places a capacitor in series with a resistor, applying a test voltage and following the charge curve for the capacitor. A high voltage drop across the capacitor indicates high reliability and a low voltage drop is used to reject the piece. The leakage current is not adversely affected during the test.

Apparatus and method for screening electrolytic capacitors

The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

Capacitor with sacrificial lead wire configuration and improved manufacturing method thereof

Aluminum surface mount capacitors containing one or more anode foil coupons are initially anodized in an aqueous phosphate solution in order to produce an anodic oxide film having extreme resistance to hydration and attack by corrosive anions for the purpose of producing surface mount capacitors at high yield and of high stability.

Surface mount aluminum capacitor having anode foil anodized in an aqueous phosphate solution

Disclosed is a process for the continuous anodizing of aluminum foil for use in aluminum electrolytic capacitors. Specifically, etched anode foil is anodized to relatively low voltage in a two-step reel-to-reel process. The process is particularly useful for anodizing highly-etched aluminum foil for use in surface mount aluminum capacitors containing conductive polymer cathode material. The process is economical and provides high foil quality. Specifically, the process for anodizing aluminum foil comprises anodizing the foil in a first electrolyte a solution, passing the foil through an oven, anodizing the foil in a second anodizing solution wherein the first electrolyte solution and second electrolyte solution each comprise about 5 wt % to about 50 wt % glycerine, about 0.01 wt % to about 0.2 wt % ammonium phosphate, and de-ionized water, and wherein the foil is anodized in the first electrolyte solution for at least 3.5 minutes

Method of anodizing aluminum capacitor foil for use in low voltage, surface mount capacitors

A process for isolating flaw sites in the dielectric of solid electrolytic capacitor comprising immersing a conductive polymer impregnated capacitor in an electrolyte solution, and then alternately subjecting the conductive polymer impregnated capacitor to a high voltage and a low voltage; wherein the high voltage is between about 10 volts and 50 volts, and the low voltage is between about 0 volts and the voltage corresponding to 90% of the anodization voltage for pellets anodized at less than 20 volts, or the voltage at which the current drops to 50% of the peak voltage current for pellets anodized at voltages greater than or equal to 20 volts. The period of time at or above the anodization voltage is relatively short to prevent damaging the dielectric film.

Aging process for solid electrode capacitor

Single element and/or multiple element valve-metal, solid-electrolyte, surface-mount capacitors are manufactured using one or more materials taken from the following three categories of materials: graphitic carbon, highly-conductive metal-powder-filled paint, and metallic terminals. The resulting capacitors have lower equivalent series resistance (ESR) at 100 kHz than do similar capacitors manufactured with conventional materials and with conventional techniques. Moreover, not only do these devices possess lower &ldquo;as-manufactured&rdquo; ESR, but also their ESR is substantially more stable (less increase in ESR) when these devices are exposed to IR reflow temperatures, high humidity, thermal shock, 1000 hours at 150&deg; C., and 1000 hours at 175&deg; C.

Combinations of materials to minimize ESR and maximize ESR stability of surface mount valve-metal capacitors after exposure to heat and/or humidity

Multielement capacitors have at least one metal capacitor and at least one ceramic capacitor with common terminals in a common case. The preferred metal capacitance elements have an effective series capacitance of at least 1 microfarad at frequencies of up to 100 kHz. The individual metallic capacitance elements exhibit an ESR of less than 100 milliohms at 100 kHz and a dissipation factor (DF) of less than about 6% at 120 Hz. The ceramic capacitance elements useful in the invention have an equivalent series capacitance of at least about 0.1 microfarads at frequencies of up to about 100 MHz. The individual ceramic capacitance elements have an ESR of less than 20 milliohms at 1 MHz and a dissipation factor of less than 10% at 1 kHz.

Growing community of inventors

Simpsonville, SC, United States of America

Erik Karlsen Reed