Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Continental Automotive Gmbh

Technische Unversität Berlin

Erik Jung

Robert Ingenbleek

Andreas Ostmann

Tanja Braun

Kenneth Kaskoun

Karl-Friedrich Becker

Andreas Rekofsky

Stefan Kubick

Lars Böttcher

Alfred Kolb

Roland Schöllhorn

Daniela Wolf

Mathias Koch

Werner Budweiser

Leopold Georgi

An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.

Electronic circuit arrangement and method for producing an electronic circuit arrangement

A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.

Method for producing encapsulated chips

A substrate ( ) includes a conductive layer ( ) which is non-wettable by solder. A solder receiving stud ( ) is formed on the conductive layer, preferably by plating. If used for transferring solder, a solder bump ( ) is selectively formed on the solder receiving stud since the surrounding conductive layer is not wettable by the solder. A receiving substrate, such as a semiconductor device ( ), is aligned with the substrate. The solder bump is heated to a liquidus state and the solder bump makes physical contact with a solder accepting stud ( ) of the receiving substrate. Because the area of the solder accepting stud is larger than the area of the corresponding stud on the transfer substrate, the majority of the solder will transfer to the receiving substrate upon separation. Alternatively, the device could itself already have bumps formed thereon, in which case an unbumped substrate is used to test the device, and solder remains on the device upon separation.

Method for transfering solder to a device and/or testing the device

Growing community of inventors

Falkensee, Germany

Erik Jung