Seagate Technology Incorporated

Erik Jon Lindquist

Andrew Robert Motzko

Neal Frank Gunderson

Rick Pfahl Freeman

Reed David Hanson

Antanas Daugela

David D Backlund

Ricardo P Freeman

An apparatus includes an actuator assembly, a dampening assembly coupled to the actuator assembly, and a vibration sensor assembly coupled to the dampening assembly and coupled to the actuator assembly by way of the dampening assembly. A method includes attaching a dampening assembly to an actuator assembly and attaching a vibration sensor assembly to the dampening assembly. The dampening assembly is positioned between the vibration sensor assembly and the actuator assembly.

Methods and devices for detecting shock events

An actuator for supporting data transfer elements includes an arm, a flexible circuit assembly and a sensor. The flexible circuit assembly includes a stiffener having a mount feature and a turnaround feature. The flexible circuit assembly also includes a flexible cable having a plurality of conductive traces for electrically connecting the data transfer elements to circuitry. The flexible cable has a service loop portion, a mounting portion coupled to the mount feature of the stiffener and a turnaround portion coupled to the turnaround feature of the stiffener. The turnaround portion is configured to couple the mounting portion to the service loop portion. The sensor is in contact with a surface of the arm and is electrically coupled to the flexible cable.

Arm mounted shock sensor and flexible circuit routing

A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects

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Oakdale, MN, United States of America

Erik Jon Lindquist