Asml Netherlands B.v.

Erik Henri Adriaan Delvigne

Hakki Ergün Cekli

Willem Seine Christian Roelofs

Michiel Kupers

Alexander Ypma

Cédric Désiré Grouwstra

Erik Johannes Maria Wallerbos

Marc Hauptmann

Weitian Kou

Stefan Cornelis Theodorus Van Der Sanden

David Frans Simon Deckers

Lydia Marianna Vergaij-Huizer

Manuel Giollo

Iryna Dovbush

Elliott Gerard McNamara

Emil Peter Schmitt-Weaver

Masashi Ishibashi

Wendy Johanna Martina Van De Ven

Rizvi Rahman

Hakki Ergun Cekli

A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

Methods of determining corrections for a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus

Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.

Method of obtaining measurements, apparatus for performing a process step, and metrology apparatus

Methods of determining corrections for a patterning process

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Breda, Netherlands

Erik Henri Adriaan Delvigne