Koninklijke Philips Corporation N.v.

Anteryon Bv

Erik Harold Groot

Arjen Gerben Van Der Sijde

Edwin Maria Wolterink

Anton Petrus Maria Van Arendonk

Leendert De Bruin

Gerardus Maria Dohmen

Aloysius Franciscus Maria Sander

The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Camera device, method of manufacturing a camera device, wafer scale package

The invention relates to a camera module. The camera modulecomprises a holder, which provides a light-conducting channel. Within the light-conducting channela lenshaving an optical axisis present. A solid-state image sensoris present near an endof the light-conducting channel. The image sensoris provided with an image pick-up section, which is oriented perpendicularly to the optical axis. Near the endof the light-conducting channel, forming part of the holder, aligning meansare present for aligning the image pick-up sectionwith the optical axis. In one embodiment of the camera module, the inner wallof the holderis substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis. Bulgespresent near the corners of the rectangle form the aligning means. The bulgesare provided with L-shaped recessesin which the lateral surfacesof the solid-state image sensorare placed substantially without play. This method of aligning the image pick-up sectionwith the optical axissimplifies the manufacture of the camera module

Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module

A socket () for accommodating and testing a component () having several electrical connectors () is disclosed, which socket comprises a substantially rectangular frame () surrounding a space (), which frame () includes a first row () and a second row () of electric conductors () which are arranged opposite one another, which conductors () have first section () with a terminal () extending into space () for contacting an electric connector () of the component (), and a second section () projecting from the frame (). The spacing () between the terminals () in each row () is adjustable. In the method of testing a component () in the socket (), the spacing () between the terminals () in each row () is adjusted to establish electrical contact between the electrical connectors () of the component () and its corresponding terminal () by placing the component () in the socket ().

Socket for testing a component and method of testing a component

Growing community of inventors

Eindhoven, Netherlands

Erik Harold Groot