Zkw Group Gmbh

Erik Edlinger

Dietmar Kieslinger

Emanuel Weber

Markus Lahner

Wolfgang Manhart

Roman FÜHRINGER

Bernd Dragosits

The invention relates to an electronic module () comprising at least one printed circuit board of a first type (referred to as 'printed circuit board A'), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as 'printed circuit hoard B'), printed circuit board B being equipped with at least one electronic component with specific requirements (), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (). The composite printed circuit board () is delimited at least in some regions by end regions () which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board () is placed on a heat sink (). A fastening side () of the at least one printed circuit board B rests flat on a contact face () of the heat sink (), the contact face () of the heat sink () being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side () of the at least one printed circuit board B in each case towards the end regions () formed. Supporting elements () are formed on the contact face () of the heat sink for the mechanical support of the end regions (). The invention also relates to a method for producing such an electronic module.

Electronic printed circuit board assembly for high-power components

In a printed circuit board (), thermal vias () are formed between the lower surface (A) and an upper surface (B) of the substrate plate () of the printed circuit board through the steps of: applying a respective solder resist mask () to the lower surface (A) and the upper surface (B); applying solder to the lower surface (A) and reflow soldering the solder, wherein the solder penetrates into the boreholes () and forms convex menisci () protruding beyond the edge () of the respective boreholes on the lower surface (A); and creating regions () on the upper surface (B), which are freed from solder resist material, and which are intended for contacting at least one electronic component () on the upper surface and each of which comprise at least one of the thermal vias. Subsequently, the upper surface (B) can be provided with electrical components () on these regions (). The first solder resist mask () has a respective region () that is free of solder resist on the lower surface around the edge of every borehole ().

Method for producing a printed circuit board having thermal through-contacts

The invention relates to a process to connect, by soldering, at least one electronic component () with a mounting plate (), the mounting plate having at least one mounting plate contact surface () and the at least one electronic component having at least one component contact surface () corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer () that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste () onto at least areas of the solder resist layer (), minimally overlapping with the mounting plate contact surface () adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (), the at least one component contact surface () at least partly covering the at least one mounting plate contact surface () corresponding to it; and c) Heating the solder paste () to produce a soldered connection between the mounting plate and the at least one component.

Method for void reduction in solder joints

A component cooling device () comprising: a circuit board (), the circuit board () having an upper side () and a lower side () facing away from the upper side (); and at least one electronic component () and at least one hollow circuit board opening () for a gaseous cooling medium for cooling the component, wherein on the lower side () of the circuit board () is provided a guide () which forms a flow channel () that has at least one inlet () and at least one outlet, which is formed by the at least one circuit board opening (), for at least one convection flow () of the cooling medium.

Component cooling device

A headlamp for vehicles, in which the laser beam of at least one laser light source () is directed via a beam deflection means () towards at least one light conversion means () in a scanning manner, which at least one light conversion means comprises a phosphor for converting light, and having a projection system () for projecting the light image () generated at the light conversion means onto the roadway (), characterized in that at least one electro-optical modulator () is arranged in the beam path of the at least one laser light source (), which at least one electro-optical modulator is controlled by a control unit () and lies before the light conversion means () in the beam path and affects the polarization of the light, wherein a polarization element () is arranged at least after the modulator in the beam path.

Headlamp for vehicles having at least one laser light source

A printed circuit board () comprising an insulating layer () and a conducting layer () arranged on the insulating layer () and structured into a contact surface () for an electronic component () which is to be populated on the printed circuit board () has, in the area of the contact surface (), at least one channel () that passes through the contact surface () and the insulating layer () and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer () and a conducting layer () connected with the insulating layer (); producing at least one channel () passing through the conducting layer () and the insulating layer (); lining the channel () with thermally conductive material; structuring the conducting layer () into a contact surface () for an electronic component () to be populated on the printed circuit board; preparing a solder deposit () at least minimally overlapping with the contact surface (); setting down the electronic component (); melting the solder, and cooling.

Growing community of inventors

Vienna, Austria

Erik Edlinger