Delphi Technologies, Inc.

Delco Electronics Corporation

Erich William Gerbsch

Ralph S Taylor

Roger A Mock

Robert J Campbell

Monty B Hayes

Jeffrey J Ronning

Michael A Jeter

Scott David Brandenburg

Bruce Alan Myers

Carl William Berlin

Charles T Eytcheson

Richard Dixon Parker

Darrel Eugene Peugh

Robert D Maple

Lester Wilkinson

Todd G Nakanishi

Lisa A Viduya

Gary Lynn Eesley

Andrew R Hayes

Eric Von Kierstead

A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Liquid cooled electronics assembly suitable to use electrically conductive coolant

A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.

Semiconductor power module with flexible circuit leadframe

A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a second parallel flow path through the cover, and then converges and discharges through an outlet. The semiconductor devices have upper and lower active areas that are thermally coupled to inboard faces of the cover and base for low double-sided thermal resistance, and the devices are electrically accessed through a set of terminals formed on the base. Multiple sets of semiconductor power devices are double-side cooled by joining multiple fluid conducting covers to the base such that the coolant successively diverges and then re-converges at the locations where each cover is joined to the base. Preferably, the flow paths in both the base and cover include integral features for enhancing the surface area in contact with the coolant.

Fluid cooled semiconductor power module having double-sided cooling

An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

Power semiconductor package having integral fluid cooling

A vertical laminated electrical switch circuit includes a first, second, and third ceramic substrate positioned in juxtaposed relationship relative to each other. The circuit also includes a first and second electrical device electrically coupled to each other. The first electrical device is coupled to the first and second substrates and positioned there between. The second electrical device is coupled to the second and third ceramic substrates and positioned there between. In some embodiments, multiple electrical devices may be coupled to a single substrate.

Vertical laminated electrical switch circuit

An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

Electronics assembly having multiple side cooling and method

An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.

Electrically isolated and thermally conductive double-sided pre-packaged component

An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable cooper material are directly bonded to the inner and outer surfaces of the substrate members.

An electronics assembly is provided, including a housing and at least one electronic power device positioned within. A heat sink device is positioned within the housing and is in thermal communication with the electronic power device . The heat sink device includes a fluid vessel , a fluid input port , a fluid output port , and at least one fin insert brazed into the fluid vessel . The heat sink device is in fluid communication with an automotive radiator such that coolant flows from the automotive radiator through the fluid vessel thereby cooling the electronic power device

Automotive electronics heat exchanger

An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

Interconnect assembly for an electronic assembly and assembly method therefor

A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second and third stamped elongate metal plates disposed side-by-side atop the common terminal. Connection areas formed on the positive and negative terminals extend in opposite lateral directions, and interdigitate with connection areas formed on the common terminal, thereby forming two linear parallel rows of connection areas. Adjacent each row of connection areas, and mounted on a baseplate of the module is a set of parallel connected transistors subassemblies. A molded elongate gate collection component is mounted on the baseplate between the sets of transistor subassemblies, and beneath the common terminal. The gate collection component confines a pair of insert molded gate terminal strips to which the gate terminals of the respective sets of transistor subassemblies are connected, and the terminal strips, in turn, are coupled to gate terminals of the module. The transistor subassemblies are mounted in close proximity to the central terminal structure, and the metal tabs of the subassemblies are shaped to prevent interference with the overlying terminal connection areas, and to provide stress relief.

Growing community of inventors

Cicero, IN, United States of America

Erich William Gerbsch