Intel Corporation

Erich Nolan Ewy

Johanna M Swan

Adel A Elsherbini

Telesphor Kamgaing

Georgios C Dogiamis

Sasha N Oster

Kenneth D Shoemaker

Matthew Lee

Benedict C Ofuonye

Jeffrey Willcoxon

Michael Aaron Schroeder

Iwan Ricardo Grau

Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

Mmwave dielectric waveguide interconnect topology for automotive applications

Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars

Methods and apparatus relating to processor and chipset continuity testing of package interconnect for functional safety applications are described. In an embodiment, voltage divider logic circuitry divides a reference voltage. Controller logic circuitry compares a divided voltage value from a node of the voltage divider logic circuitry and a threshold voltage value. A first end of the voltage divider logic circuitry is coupled to receive the reference voltage and a second end of the voltage divider logic circuitry is coupled to a Non-Critical-To-Function (NCTF) solder ball. The controller logic circuitry generates an error signal in response to a mismatch between the divided voltage value and the threshold voltage value. Other embodiments are also disclosed and claimed.

Processor and chipset continuity testing of package interconnect for functional safety applications

Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Mmwave waveguide to waveguide connectors for automotive applications

Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

Mmwave waveguides featuring power-over-waveguide technology for automotive applications

Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a heat source, a heat sink over the heat source, and an active loading mechanism coupled to the heat sink, where the heat sink is thermally decoupled from the heat source when the active loading mechanism is not activated and the heat sink is thermally coupled to the heat source when the active loading mechanism is activated. In an example, the active loading mechanism includes shape memory material and the shape memory material is activated when a temperature of the heat source satisfies a threshold temperature.

Activate loading mechanism

Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

Crimped mm-wave waveguide tap connector

In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.

Modular heat transfer system

Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.

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Phoenix, AZ, United States of America

Erich Nolan Ewy