Siemens Aktiengesellschaft

Vitesco Technologies Gmbh

Continental Automotive Gmbh

Mannesmann Vdo Ag

Vitesco Technologies Usa, LLC

Erich Mattmann

Waldemar Brinkis

Klaus Weber

Martin Maasz

Jeffrey J Frye

Bernd Thyzel

Robert Peter

Soeren Rittstieg

Christian Kiefl

Jürgen Zacherl

Roland Brey

Kay Schwarzkopf

David W Ivaska

Richard E Cronin

Frank Langner

Michael Nitzschke

Joe Pin Wang

Sabine Bergmann

Burkhard Dasbach

Christian Weigert

Gary Collier, I

Andreas Gerull

Gerhard Kallweit

A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.

Pressure sensor with external vertical electrical interconnection system

A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.

Power electronics assembly including a circuit carrier

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Method for through-plating a printed circuit board and such a printed circuit board

A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.

Printed circuit board and sensor

An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor.

Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer

A tank sensor circuit board for a fill level sensor in a vehicle tank, including a support element, on which contact surfaces containing silver are applied using thick layer technology. The contact surfaces are made up of a silver layer and a top layer containing nickel, palladium and gold, completely or partly covering the silver layer.

Tank sensor circuit board for a fill level sensor in a vehicle tank

A force sensor includes a diaphragm-like carrier made of ceramic. Arranged on the carrier are thick-film resistors and a circuit of strain-sensitive thick-film conductor tracks, which are formed in particular as a Wheatstone bridge connecting the thick-film resistors to one another. A dielectric layer is arranged between the carrier and the thick-film resistors

Force sensor

An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Electronics unit

A pressure sensor includes a membrane having a radially peripheral edge region fixedly arranged on a support. One side of the membrane can be acted on by a medium being measured and the membrane can be deflected in response to pressure of the medium. Measuring elements and an electric circuit interconnecting the measuring elements are arranged on the membrane, the measuring elements and the circuit being applied by the thick-film technique and sintered on in a thermal process. The membrane is made of an electrically conducting metal and bears an insulating layer, on which the measuring elements and the electric circuit are arranged. In this case, the insulating layer consists of a material having a coefficient of expansion that lies between the coefficient of expansion of the metal of the membrane and the coefficient of expansion of the material of the measuring elements and the electric circuit.

Pressure sensor with membrane and measuring elements arranged on the membrane

In a device for measuring the axle load of a motor vehicle, at least one extension-sensitive resistor is arranged on at least one component of a motor vehicle which is subject to a change in shape as a function of the load, with at least one insulating layer being arranged in between.

Device for measuring the axle load of a motor vehicle

An electrical circuit having at least one electrical component, in particular a strain-sensitive resistor and conductor tracks which are applied to a metallic carrier with the intermediate positioning of at least one insulating layer, at least one further conductor track, which is connected to at least one conductor track of the circuit, is applied to the surface of the metallic carrier. The invention also relates to methods for manufacturing the electrical circuit.

Electrical strain sensitive resistor

A method for producing an electric resistor, in particular a resistance strain gauge, in which an insulating layer and a resistive layer are sequentially applied to a carrier element. The insulating layer or the resistive layer is applied to a backing sheet, the side of the backing sheet carrying the insulating or resistive layer being covered with a flexible film layer whose adhesion to the insulating layer or resistive layer is stronger than the adhesion of the backing sheet to the insulating layer or resistive layer. The film layer with the insulating or resistive layer is peeled off of the adhesive backing sheet and applied to a carrier element, which is heated to burn off the film layer and sinter on the insulating or resistive layer.

Growing community of inventors

Heidesheim, Germany

Erich Mattmann