Sun Microsystems, Inc.

Erich H Selna

Clifford B Willis

Kenneth Kitlas

Ehsan Ettehadieh

Lee Winick

James LaGassa

Myra Torres

Tak Eng

A land grid array package or a ball grid array package is electrically connected by an elastomeric type layer (containing alternating elements of conductive and non-conductive silicone) to a printed wire board or motherboard. A hold-down collar engages the peripheral edges of the package and snaps into holes in the board in such manner as to create pressure on the elastomeric layer, causing the layer to compress and create through-going electrical paths between exposed lands or conductive elements on the bottom of the package and exposed conductive elements on the wiring board. In one embodiment, solder balls adhere to the exposed conductive elements on the bottom of the package. In this embodiment the collar is initially in two pieces which are fitted together to engage both the top and bottom edges of the substrate.

Hold-down collar for attachment of IC substrates and elastomeric

A single in-line memory module (SIMM) having on-board regulation circuits is disclosed. The present invention includes a plurality of inputs. These inputs include a first reference voltage signal. The present invention employs a plurality of memory elements that are arranged to form a datapath having a predetermined width. These memory elements operate at a second reference voltage signal that is different from the first reference voltage signal received by the SIMM. On-board regulation circuits are provided to translate the first reference voltage signal into the second reference voltage signal so that the memory elements of the SIMM can use the first reference voltage signal. A driver for providing an interface between the memory elements and a computer system is also provided. This driver may also operate at the second reference.

Single in-line memory module having on-board regulation circuits

A three-layer BGA package includes a BGA Vss plane disposed between upper and lower BGA package traces, and also includes upper and lower BGA package Vss traces on the outer periphery of the BGA package. Vias electrically and thermally couple the BGA Vss plane to upper and lower BGA package Vss traces. Other vias electrically couple Vdd and IC signals from Vdd and signal traces on the upper and lower surfaces of the BGA package. Solder balls connected to the BGA package lower traces are soldered to matching traces on a system PCB. The periphery Vss traces, vias and solder balls help maintain current flow in the BGA Vss plane. In addition to providing a low impedance current return path (and thus reduced ground bounce and reduced IC signal delay time) for current sunk by an IC within the BGA package, the BGA Vss plane provides heat sinking. A four-layer BGA package further includes a BGA Vdd plane located intermediate the BGA Vss plane and the traces on the lower surface of the BGA package. Fabricated from two pieces of symmetrical printed circuit board material, this embodiment reduces ground bounce for IC current sourcing as well as IC current sinking, and provides approximately a 100% improvement in thermal dissipation as compared to prior art BGA packages.

Ball grid array package for an integrated circuit

An electrical assembly which secures a detached cable/connector assembly to a substrate of a printed circuit board. The assembly has a printed circuit board that is mounted to a first surface of the substrate. The printed circuit board is coupled to an electrical connector assembly by a flexible cable. The electrical connector assembly can be plugged into an auxiliary device such as a CD-ROM. The electrical connector assembly has a tab that is inserted into an aperture located in the second surface of the substrate, to secure the connector assembly when the connector is not attached to the auxiliary device.

Backbone substrate for a computer

Ball grid array package for a integrated circuit

An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ('TAB') integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.

Growing community of inventors

Mountain View, CA, United States of America

Erich H Selna