Enthone Incorporated

Macdermid Enthone Gmbh

Alpha Metals, Inc.

Polyclad Laminates, Inc.

Eric Yakobson

Richard W Hurtubise

Elie H Najjar

Shaopeng Sun

Vincent Paneccasio, Jr

Abayomi I Owei

Hiep X Nguyen

Christian Witt

Kyle M Whitten

Qingyun Chen

Wenbo Shao

John Commander

Jianwen Han

Taylor L Wilkins

Thomas B Richardson

Peter Thomas McGrath

Charles Valverde

Nicolai Petrov

Saeed Sardar

Abayomi Owei

A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprising: (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and/or stress modifiers to produce bottom-up filling of vias and trenches.

Composition and method for fabrication of nickel interconnects

A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process. The method includes the steps of treating the dielectric or semiconductor substrate with an aqueous pretreatment solution comprising one or more adsorption promoting ingredients capable of preparing the substrate for deposition of the diffusion barrier layer thereon; and contacting the treated dielectric or semiconductor substrate with a deposition solution comprising manganese compounds and an inorganic pH buffer (optionally, with one or more doping metals) to the diffusion barrier layer thereon, wherein the diffusion barrier layer comprises manganese oxide. Also included is a two-part kit for treating a dielectric or semiconductor substrate to form a diffusion barrier layer thereon.

Method and wet chemical compositions for diffusion barrier formation

Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

Cobalt filling of interconnects

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.

Capping of metal interconnects in integrated circuit electronic devices

An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.

Cobalt and nickel electroless plating in microelectronic devices

A process for removing patterned negative working resist from the surface of a substrate during manufacture of printed wiring boards is disclosed. The process includes the steps of contacting the patterned resist with a stripping solution containing an alkalinity source as well as a source of ammonium ions. The stripping solution is characterized in that it does not contain volatile organic compounds (VOCs).

Resist stripping process

A novel photoresist stripping process is disclosed. Specifically, it has been found that if a printed wiring board panel having photoresist on its surface is used as a cathode during electrolysis in an alkaline solution, the result is a rapid and complete photoresist removal with minimal sheeting of removed photoresist and no evidence of chemical attack upon metallic traces on the printed wiring board.

Cathodic photoresist stripping process

A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric-based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.

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Aliso Viejo, CA, United States of America

Eric Yakobson