International Business Machines Corporation

United States of America As Represented by the Secretary of the Air Force

Eric W Hearn

Gary Markovits

Murlidhar V Kulkarni

Brian J Elliott

Ralph G Dessauer

Patrick W Chye

James F Francis

Method for reducing oxygen precipitation in silicon wafers

A method or technique is disclosed for predicting precisely where oxygen precipitation will occur in semiconductor wafers that are being processed in connection with integrated circuit manufacture; the technique is based upon the discovery that such precipitation will occur at resistivity peaks measured prior to any thermal treatment of the wafers. In other words, the technique permits characterizing the wafers by the diametral resistivity profile that is obtained in the initial resistivity measurements, whereby a change in oxygen precipitation can be predicted precisely where compensated intrinsic regions have been measured in the initial measurements.

Technique for predicting oxygen precipitation in semiconductor wafers

A holding assembly for impact sound stressing semiconductor wafers and the like including a novel fixture for securing the wafer across a sound tube by clamping between Teflon rings. A cover membrane is also secured across the sound tube to create a closed space defined by the sound tube, cover membrane and semiconductor wafer. Tungsten spheres located in the closed space bounce between the wafer and the membrane when vibrations are propagated in the sound tube for impact sound stressing the semiconductor wafer.

Impact sound stressing holding assembly

Growing community of inventors

Wappingers Falls, NY, United States of America

Eric W Hearn