Saint-Gobain Ceramics & Plastics, Inc.

Eric Virey

Brahmanandam V Tanikella

Robert A Rizzuto

Elizabeth Thomas

Jadwiga Jaroniec

Frank L Csillag

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise &#x3b1;-AlOand an organic phosphate.

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Portland, OR, United States of America

Eric Virey