Johnstech International Corporation

Eric V Kline

David A Johnson

Donald L Fulcher

A high performance electromechanical device which improves electrical continuity between a device under test (DUT) and a socket (or contactor), ideally suited for, but not limited to, automated semiconductor test. An ultrasonic transducer is incorporated into the test set-up such that its ultrasonic energy is coupled either into the DUT and thereby into the contacts of the socket or is coupled into the contacts of the socket and thereby into the leads (or equivalent I/O) of the DUT. This coupled ultrasonic energy generates a high frequency mechanical wipe action of microscopic amplitude between the contacting surfaces, thereby displacing oxides and other debris from the contact site. This enhances electrical continuity by reducing apparent contact resistance and by reducing the apparent contact resistance force rate. This high frequency/low amplitude mechanical wipe action can be varied and controlled to yield an effective wipe which is from 10 times to 100,000 times greater than the current state of the art.

Electrical continuity enhancement for sockets/contactors

An interconnection device for interconnecting a number of first terminals to a number of second terminals. The interconnection device includes a conductive housing and a number of contacts that are insulated from the conductive housing. This configuration may provide shielding to the number of contacts from outside sources of electro-magnetic interference. Further, a number of conductive ribs may be provided between adjacent contacts, thereby shielding the contacts from cross-talk interference between adjacent contacts. Finally, the impedance of each contact in the interconnection device may be controlled to provide a stable bandpass, and may be programmable to match, or correct for, the input impedance of a corresponding device.

Impedance controlled interconnection device

An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the 'distorting' nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may 'process' the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

Apparatus for providing controlled impedance in an electrical contact

Apparatus for use in testing a semiconductor device located on a wafer. The apparatus includes a wafer body. A device contact region is located on the wafer body. Further, an active component region is coupled to the device contact region. A mechanism is provided for coupling the active component region to a remote testing device. The active component region may include test signal conditioning circuits and device testing circuits. The active component region may be formed integral the wafer body by silicon wafer processing techniques, such as silicon doping.

Active wafer level contacting system

An interconnecting device for electrically interconnecting a number of device terminals to a number of board terminals. The interconnecting device includes a housing which has a number of contact receiving slots wherein each slot receives one of a number of contacts. A shielding layer is provided to enhance noise immunity by shielding each contact against electromagnetic interference (EMI). The shielding layer absorbs stray radiated EMI from each one of the number of contacts and dissipates the absorbed energy as thermal energy.

Integrated circuit test socket with enhanced noise imminity

A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus may include a contact engagable by the lead and further engagable by the spaced terminal. An elastomeric element is provided to bias the contact in an original position. As the contact is engaged by the lead, the elastomeric element may deform to permit movement of the contact. It is contemplated that the elastomeric element may be shaped, relative to the contact, to provide at least one spatial relief region between the elastomeric element and the contact. Further, it is contemplated that the elastomeric element may have one or more cavities formed therein to provide at least one spatial relief region. Finally, it is contemplated that the contact housing may be designed to provide at least one spatial relief region adjacent the elastomeric element. Accordingly, as a force is applied to the contact via a lead or the like, the elastomeric element may become deformed, causing a portion of the deformed elastomeric element to extend at least partially into the at least one spatial relief region. It has been found that by providing even a modest spatial relief region adjacent the elastomeric element, the lifetime of the elastomeric element may be substantially increased.

Electrical interconnect contact system

A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus includes a conductive element comprising a first contact, a shoulder, and a second contact. The first contact is attached to the shoulder and extends upward therefrom, and the second contact is attached to the shoulder and extends downward therefrom. The first contact is electrically coupled to the lead of the device when the lead of the device is brought into engagement with the first contact. The second contact is electrically coupled to the terminal. A support member is positioned below the shoulder of the conductive element and a resilient biasing means comprising an elastomeric material is positioned between the shoulder of the conductive element and the support member. The resilient biasing means resiliently biases the conductive element in an original position. When a downward force is applied to the conductive element, however, the resilient biasing means may be overcome thereby allowing the conductive element to move in a downward direction in response to the downward force. The resilient biasing means returns the conductive element to the original position when the downward force is removed.

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Stillwater, MN, United States of America

Eric V Kline