Battelle Memorial Institute

Vitex Systems, Inc.

Samsung Display Co., Ltd.

Delphi Technologies, Inc.

Eric Sidney Mast

Gordon Lee Graff

Mark Edward Gross

Peter Maclyn Martin

Michael G Hall

Ming Kun Shi

Paul E Burrows

John D Affinito

Wendy D Bennett

Charles C Bonham

Ming-Kun Shi

J Chris Pagano

Karl Jacob Haltiner, Jr

Vincent L Sprenkle

Kerry D Meinhardt

Subhasish Mukerjee

Jin Yong Kim

Xi Chu

Nicole Rutherford

Martin Philip Rosenblum

Robert Walty

A method of manufacturing a solid oxide fuel cell stack having an electrically conductive interconnect, including the steps of: (a) providing a first fuel cell and a second fuel cell, (b) providing a substrate having an iron-chromium alloy, (c) depositing a layer of metallic cobalt over a portion of substrate surface, (d) subjecting the layer of metallic cobalt to reducing conditions, (e) then exposing the remaining portion of the layer of metallic cobalt to oxidizing conditions for a predetermined time and temperature, such that the surface portion of the layer of metallic cobalt is oxidized to cobalt oxide, thereby forming the electrically conductive interconnect having a layer of metallic cobalt sandwiched between a surface layer of cobalt oxide and the layer of cobalt-iron-chromium alloy, and (f) sandwiching the substrate between the first and second fuel cells.

Method of manufacturing a fuel cell stack having an electrically conductive interconnect

An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Method for edge sealing barrier films

An edge-sealed, encapsulated environmentally sensitive device. The device includes an environmentally sensitive device, and at least one edge-sealed barrier stack. The edge-sealed barrier stack includes a decoupling layer and at least two barrier layers. The environmentally sensitive device is sealed between an edge-sealed barrier stack and either a substrate or another edge-sealed barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Multilayer plastic substrates

A barrier assembly. The barrier assembly includes at least one barrier stack having at least one barrier layer and at least one polymer layer. The barrier stack has an oxygen transmission rate of less than 0.005 cc/m/day at 23&#xb0; C. and 0% relative humidity, and an oxygen transmission rate of less than 0.005 cc/m/day at 38&#xb0; C. and 90% relative humidity. The barrier stack also has a water vapor transmission rate of less than 0.005 g/m/day at 38&#xb0; C. and 100% relative humidity. A method for making a barrier assembly is also disclosed.

Ultrabarrier substrates

An edge-sealed, encapsulated environmentally sensitive device. The device includes at least one initial barrier stack, an environmentally sensitive device, and at least one additional barrier stack. The barrier stacks include at least one decoupling layer and at least one barrier layer. The environmentally sensitive device is sealed between the at least one initial barrier stack and the at least one additional barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

An encapsulated display device. The device includes a substrate, an environmentally sensitive display device adjacent to the substrate, and at least one first barrier stack adjacent to the environmentally sensitive display device. The barrier stack encapsulates the environmentally sensitive display device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated display device optionally includes at least one second barrier stack located between the substrate and the environmentally sensitive display device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated display device is also disclosed.

Method of making encapsulated display devices

A method for plasma enhanced chemical vapor deposition of low vapor monomeric materials. The method includes flash evaporating a polymer precursor forming an evaporate, passing the evaporate to a glow discharge electrode creating a glow discharge polymer precursor plasma from the evaporate, and cryocondensing the glow discharge polymer precursor on a substrate as a cryocondensed polymer precursor layer, and crosslinking the cryocondensed polymer precursor layer thereon, the crosslinking resulting from radicals created in the glow discharge polymer precursor plasma.

Plasma enhanced chemical deposition with low vapor pressure compounds

Encapsulated display devices

An encapsulated organic light emitting device. The device may include a substrate, an organic light emitting layer stack adjacent to the substrate, and at least one first barrier stack adjacent to the organic light emitting device, the at least one first barrier stack comprising at least one first barrier layer and at least one first decoupling layer wherein the at least one first barrier stack encapsulates the organic light emitting device. There may be a second barrier stack adjacent to the substrate and located between the substrate and the organic light emitting device. The second barrier stack has at least one second barrier layer and at least one second decoupling layer. A method of making the encapsulated organic light emitting device is also provided.

Environmental barrier material for organic light emitting device and method of making

An encapsulated microelectronic device. The device includes a semiconductor substrate, microelectronic device adjacent to the semiconductor substrate, and at least one first barrier stack adjacent to the microelectronic device. The barrier stack encapsulates the microelectronic device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated microelectronic device optionally includes at least one second barrier stack located between the semiconductor substrate and the microelectronic device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated microelectronic device is also disclosed.

Semicoductor passivation using barrier coatings

An encapsulated organic light emitting device. The device includes a first barrier stack comprising at least one first barrier layer and at least one first polymer layer. There is an organic light emitting layer stack adjacent to the first barrier stack. A second barrier stack is adjacent to the organic light emitting layer stack. The second barrier stack has at least one second barrier layer and at least one second polymer layer. A method of making the encapsulated organic light emitting device is also provided.

Growing community of inventors

Richland, WA, United States of America

Eric Sidney Mast