The Whitaker Corporation

Eric Shek-Fai Mak

Ching-Long Jiang

Bill Henry Reysen

Steven Patrick O'Neill

A package for an optoelectronic device having an optical fiber in communication therewith. The parts of the package are generally of polymer material, preferably engineering thermoplastic, which is assembled to the fiber having the device mounted on a printed circuit board type material, FR4. The adhesion process of the individual parts of the package is done typically through a solvent bonding or an epoxy curing process that is done at room temperature, thereby eliminating the drawbacks of soldering at high temperature which has the attendant disadvantage of built in stress and thermal expansion resulting in misalignment of the individual parts. The related packaging technique greatly reduces the requirements of active alignment of the fiber to the device in the packaging of the device and fiber. Accordingly, the overall cost of the device is reduced by virtue of the reduced cost of the parts of the package as well as the process for fabrication of the package.

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Bellemeade, NJ, United States of America

Eric Shek-Fai Mak