Stmicroelectronics (grenoble 2) Sas

Stmicroelectronics (research & Development) Limited

Stmicroelectronics Gmbh

Stmicroelectronics S.a.

Stmicroelectronics (alps) Sas

Stmicroelectronics (rousset) Sas

Eric Saugier

Karine Saxod

Benoit Besancon

Alexandre Mas

Gaetan Lobascio

Romain Coffy

Colin Campbell

David Gani

David Auchere

Ewan Findlay

Wing Shenq Wong

William Halliday

Laurent Schwarz

Luc Petit

Hk Looi

Deborah Cogoni

Roy Duffy

Rémi Brechignac

Jean-Luc Diot

Jacques Chavade

Hazel McInnes

Kum Weng Loo

Norbert Chevrier

Stuart Brodie

Dominique Marais

Gemma Ramsey

Mickael Miglietti

Fabrice Mee

A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

Method for manufacturing a cover for an electronic package and electronic package comprising a cover

The disclosure concerns a semiconductor chip, which may be an interposer, having conductive through vias having a parallelepipedal shape.

Conductive vias

An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.

Electronic module including an ambient light sensor stacked over a proximity sensor

An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.

Electronic device including at least one electronic chip and electronic package

Method for making a cover for an electronic package and electronic package comprising a cover

A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Proximity and ranging sensor

An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Optical electronic package

An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Dual side package on package

The internal propagation of radiation between a radiation source and radiation detector mounted within a sensor package is prevented by the use of an optical isolator. The optical isolator is formed by the combination of a baffle mounted between the source and detector and a groove formed in an upper surface of the sensor package between the source and detector. A bottom of the groove is positioned adjacent to an upper edge of the baffle.

Proximity sensor

A semiconductor device includes a first wafer having at least one first integrated-circuit chip and a first support layer surrounding the first integrated circuit chip. A first electrical-connection layer is placed on a frontside of the first wafer and includes a first electrical-connection network. A second wafer is placed on a frontside of the first electrical-connection layer. The second wafer includes at least one second integrated-circuit chip and a second support layer surrounding the second integrate circuit chip. The second integrated circuit chip has an active side facing the first electrical-connection layer, and one or more through-holes filled with a conductor forming electrical-connection vias. A second electrical-connection layer is placed on the backside of the second wafer and includes a second electrical-connection network.

Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias

A focusing device for a lens, including a frame, a lens carrier movable relative to the frame from a first position along an optical axis, a motor for driving the lens carrier along the optical axis, and at least one biasing member adapted to bias the lens carrier towards the first position. The biasing member may include one or more bending members.

Focussing apparatus

A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Cap including a housing and optically transparent member to protect a camera module lens

A barrel for an electrically-controllable variable focal length lens in a button-battery type housing includes a hollow isolating cylindrical tube with an inner diameter substantially equal to that of the lens housing, with one or bumps extending radially towards the inside of the tube and forming bearing surfaces for the lens periphery in a same radial plane. First metallizations extend on at least one of the bearing surfaces and therefrom into first channels formed in the internal wall of the tube towards at least one end of the tube, and second metallizations, each of which forms a contact area on the internal surface of the tube to bear against the lateral surface of the lens and extends towards at least one end of the cylinder.

Barrel of variable focal length lens

An assembly structure of a mobile objective above an optical sensor assembled on a support board includes a cover assembled on the support board with an opening facing the sensor, this cover having a conical external surface with an axis orthogonal to the support board. The structure also includes a frame having first and second elements, shiftable with respect to each other under the action of an electric motor. The first frame element has a conical internal surface capable of mating with the conical external surface of the cover to ensure its positioning and to put resilient connection blades of a fixed portion of the motor in contact with pads formed on the support board, and the second frame element supports the objective and a shiftable portion of the motor.

Growing community of inventors

Froges, France

Eric Saugier