International Business Machines Corporation

Eric Salvas

Isabel De Sousa

Michel Turgeon

Annique Lavoie

Michael A Gaynes

Jon Alfred Casey

John Saunders Corbin, Jr

David Hirsch Danovitch

Kenneth Charles Marston

Virendra R Jadhav

Sylvain E Ouimet

Jennifer V Muncy

Martin Beaumier

Alexandre Blander

Pascale Gagnon

Eric Giguere

Luc Tousignant

Isabelle Depatie

Roger A Liptak

A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Thermal interface material on package

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Grounded lid for micro-electronic assemblies

A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Achieving mechanical and thermal stability in a multi-chip package

Growing community of inventors

Otterburn Park, Canada

Eric Salvas