Cmc Materials, Inc.

Eric S Moyer

Ping Huang

Chen-Chih Tsai

Paul Andre Lefevre

Justin Stewart

Jaeseok Lee

Carlos Barros

William Michael Spitzig

Holland Hodges

Devin Schmitt

A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

Chemical mechanical planarization pads with constant groove volume

A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Chemical mechanical planarization pads via vat-based production

The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.

UV-curable resins used for chemical mechanical polishing pads

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Aurora, IL, United States of America

Eric S Moyer