Micron Technology Incorporated

Intel Corporation

Eric S Carman

Daniele Vimercati

Hernan Adolfo Castro

Jeremy Miles Hirst

Durai Vishak Nirmal Ramaswamy

Haitao Liu

Kamal M Karda

Richard Edward Fackenthal

Karthik Sarpatwari

Scott James Derner

Umberto Di Vincenzo

Christopher John Kawamura

Duane R Mills

Christian Caillat

Christopher Johnson Kawamura

Some embodiments include apparatuses and methods of operating such apparatuses. One of such apparatuses includes a data line, a conductive region, and a memory cell including a first transistor and a second transistor. The first transistor includes a first channel region coupled to the data line and the conductive region, a charge storage structure, and a first gate. The second transistor includes a second channel region coupled to the data line and the charge storage structure, and a second gate. The first gate is electrically separated from the second gate and opposite from the second gate in a direction from the first channel region to the second channel region.

Memory device having 2-transistor vertical memory cell and separate read and write gates

Sense amplifiers for memory devices include latch transistors that are used to latch values based on charges in memory cells. A first latch transistor applies a reference voltage to a first gut node of the sense amplifier via one of these latch transistors. The sense amplifier also applies a charge to a second gut node from a memory cell corresponding to the sense amplifier. The sense amplifier also latches a value in the sense amplifier based on a relationship between the reference voltage and the charge.

Sense amplifier reference voltage through sense amplifier latch devices

Methods, systems, and devices for sense amplifier with digit line multiplexing are described. A method includes precharging an input and an output of an amplifier stage of a sense component to a first voltage based on a read operation associated with a memory cell. The method includes precharging a first side and a second side of a latch stage of the sense component to the first voltage based on precharging the output of the amplifier stage to the first voltage, the latch stage coupled with the amplifier stage. The method may also include coupling a second voltage from a digit line associated with the memory cell to the input of the amplifier stage, the amplifier stage generating a third voltage on the output based on coupling the second voltage to the input, and the latch stage latching a logic value associated with the memory cell based on the third voltage.

Sense amplifier with digit line multiplexing

Some embodiments include apparatuses and methods forming the apparatuses. One of the apparatuses includes a first transistor including a first channel region, and a charge storage structure separated from the first channel region; a second transistor including a second channel region formed over the charge storage structure; and a data line formed over and contacting the first channel region and the second channel region, the data line including a portion adjacent the first channel region and separated from the first channel region by a dielectric material.

Memory device having 2-transistor vertical memory cell and wrapped data line structure

Methods, systems, and devices for self-refresh of memory cells are described. A controller coupled with a memory cell may be configured to apply a first voltage to a control gate of a first transistor, where the first voltage activates the first transistor to selectively couple terminals of the first transistor with each other based on a charge stored on the interstitial gate. The controller may be configured to apply a current to a bit line, where a second voltage of the bit line is based on the current and the charge stored on the interstitial gate. The controller may be configured to apply, based on applying the first voltage to the control gate of the first transistor and applying the current to the bit line, a third voltage to a gate of a second transistor to couple the bit line with the interstitial gate of the first transistor.

Self refresh of memory cell

Methods, a memory device, and a system are disclosed to reduce power consumption in a cross-point memory device, including providing a first portion of a first pulse of a memory operation to a memory cell at a first time using a first capacitive discharge from a first discharge path, and providing a second portion of the first pulse of the memory operation to the memory cell at a second time, later than the first time, using a second discharge path.

Stored charge use in cross-point memory

Methods, systems, and devices for timing chains for accessing memory cells are described to implement some delays at logic circuitry under an array of memory cells. The memory array logic may represent CMOS under array logic circuitry. A bank group logic may generate a first memory operation and a longer delay corresponding to a timing between the first operation and a second operation. The first operation may represent an access operation, a precharging operation, or the like. The memory array logic may be signaled regarding the first operation and may generate one or more smaller delays associated with one or more sub-operations of the first operation. The smaller delays may be tunable, which may support a memory device or controller to implement operations or sub-operations with different timings based on different processes, different memory cell characteristics, or different temperatures, among other examples.

Timing chains for accessing memory cells

Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. A first ferroelectric memory cell may be used to charge a second ferroelectric memory cell by transferring charge from a plate of first ferroelectric memory cell to a plate of the second ferroelectric memory cell. In some examples, prior to the transfer of charge, the first ferroelectric memory cell may be selected for a first operation in which the first ferroelectric memory cell transitions from a charged state to a discharged state and the second ferroelectric memory cell may be selected for a second operation during which the second ferroelectric memory cell transitions from a discharged state to a charged state. The discharging of the first ferroelectric memory cell may be used to assist in charging the second ferroelectric memory cell.

Charge sharing between memory cell plates

Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ground reference scheme may be employed in a digit line voltage sensing operation. A positive voltage may be applied to a memory cell; and after a voltage of the digit line of the cell has reached a threshold, a negative voltage may be applied to cause the digit line voltages to center around ground before a read operation. In another example, a first voltage may be applied to a memory cell and then a second voltage that is equal to an inverse of the first voltage may be applied to a reference capacitor that is in electronic communication with a digit line of the memory cell to cause the digit line voltages to center around ground before a read operation.

Ground reference scheme for a memory cell

Methods, a memory device, and a system are disclosed. One such method includes providing a first pulse to one of multiple bit lines of a variable resistance memory structure at a first time using a first transistor, a second pulse to the one of the multiple bit lines at a second time later than the first time using the first transistor, and a third pulse to the one of the multiple bit lines at a third time later than the second time using a second transistor.

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San Francisco, CA, United States of America

Eric S Carman