Advanced Micro Devices Corporation

Asml Netherlands B.v.

Advanced Micro Device, Inc.

Eric Richard Kent

Vincent L Marinaro

Ted Wakamiya

Jen-Shiang Wang

Guangqing Chen

Vince L Marinaro

Yen-Wen Lu

Youping Zhang

Omer Abubaker Omer Adam

Jan Wouter Bijlsma

Shufeng Bai

Paul Anthony Tuffy

Gertjan Zwartjes

Zicheng Gary Ling

Jayendra D Bhakta

Weizhong Wang

Warren T Yu

Methods and systems for automatically generating robust metrology targets which can accommodate a variety of lithography processes and process perturbations. Individual steps of an overall lithography process are modeled into a single process sequence to simulate the physical substrate processing. That process sequence drives the creation of a three-dimensional device geometry as a whole, rather than 'building' the device geometry element-by-element.

Process based metrology target design

A method of metrology target design is described. The method includes determining a sensitivity of a parameter for a metrology target design to an optical aberration, determining the parameter for a product design exposed using an optical system of a lithographic apparatus, and determining an impact on the parameter of the metrology target design based on the parameter for the product design and the product of the sensitivity and one or more of the respective aberrations of the optical system.

Method and apparatus for design of a metrology target

In order to obviate the problem wherein localized lens aberration causes a pattern of low yield which cannot be corrected by conventional stepper correction/adjustment and which leads to the determination that the stepper lens is the source of the problem, the reticle is modified to produce an error which is selected to cancel the error that is being produced by the lens aberration and thus enable desired critical dimensions to produce on all dice. The modified reticle is then dedicated to the particular stepper.

Stepper lens specific reticle compensation for critical dimension control

Critical dimension variation of photolithographically formed features on a semiconductor substrate is reduced by measuring the reflectivity of a photoresist layer and an underlying layer, such as a polysilicon layer, and adjusting the exposure level of the photoresist in accordance with the measured reflectivity. This allows precise control of feature width on the photoresist, which in turn allows precision etching of the underlying layer to accurately form a feature, such as a gate electrode.

Exposure correction based on reflective index for photolithographic process control

An apparatus for cleaning dried photoresist from a photoresist dispensing nozzle. The tip of the photoresist dispensing nozzle is inserted through an opening in a nozzle base. A catch pan is positioned beneath the nozzle base. A solvent dispensing needle is inserted through an opening in the catch pan to face the photoresist dispensing nozzle tip and sprays solvent onto the photoresist dispensing nozzle tip. The catch pan collects the solvent and dissolved photoresist particles. The catch pan includes a drain for draining the solvent and the dissolved photoresist particles.

Apparatus for automatically cleaning resist nozzle

An apparatus for processing semiconductor wafers includes a single imaging stepper for exposing wafers processed on a first track and a second track. A method for processing semiconductor wafers includes selecting one of a first coater and a second coater for coating a first wafer with a photoresist. The coated wafer is exposed in a single stepper to form an exposed wafer. An operator selects one of a first developer and second developer to develop the exposed wafer.

Dual track/stepper interface configuration for wafer processing

A dual tip nozzle replaces a single tip nozzle in a resist applicator station to double the number of photoresists that are available. The resist applicator station is of the type having a nozzle holder block, at least one single tip nozzle attached to the nozzle holder bock, and a first resist line extending through the nozzle holder block and into engagement with the nozzle. The dual tip nozzle includes two cavities having respective orifices. Each cavity receives a separate resist line for dispensing separate photoresists.

Dual resist dispense nozzle for wafer tracks

A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45&deg;. The angling of the liquid stream toward the velocity vector on the IC wafer as the IC wafer spins reduces back-splash when the liquid stream hits the IC wafer. In addition, the liquid stream may be applied onto the surface of the IC wafer with relatively low pressure. Thus, the nozzle of the present invention dispenses liquid onto the surface of the IC wafer with minimized back-splash to reduce bubble defects within the integrated circuit fabricated on the surface of the IC wafer.

Mechanism for dispensing liquid onto an integrated circuit wafer with minimized back-splash

An air bubble purging system for filters include a venturi valve in the drain line of the filter. The venturi valve is connected to a high pressure source line so that when a high rate of flow is produced in the high pressure source line, a venturi effect is created in the venturi valve to open the venturi valve and produce a vacuum in the drain line so that air bubbles are attracted into the drain line and purged.

System and method for purging air bubbles from filters

Embodiments of the invention comprise a new device and technique to realize an improved temperature control for a chemical photoresist developer utilizing a preexisting integrated single reservoir. This improvement is achieved by providing for a modified temperature control unit and procedure. The temperature control unit preferably comprises a plurality of heat exchanger conduits that are each supplied by an inlet manifold, and then exhausted via an outlet manifold. The temperature control unit preferably extends fully within the modified nozzle unit. By utilizing the improved temperature control unit, a first and second volumetric allocation of developer may be issued so that both may be dispensed within a relatively short period of time upon a photoresist layer surface in a temperature controlled state.

Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer

A developer nozzle used to apply developer and other chemicals to a wafer in the processing of semiconductors is kept free of hardened developer or other chemicals by placing a comb-like device in a position that will let the comb be inserted into the spray holes of the nozzle when the nozzle is not in use. The teeth of the comb are tapered for easy insertion by the robot or other programmed device that controls motion of the nozzle. Although hardened developer is the principal concern in such processing, an appropriate comb can be used to maintain the cleanliness of other nozzles used in semiconductor processing.

Developer nozzle clean combs

An adjustment error in a photolithographic stepping printer is detected by applying photoresist to a semiconductor wafer, and exposing the wafer to substantially identical light images in multiple locations using a stepping printer. The light images are defined by an optical reticle and include a plurality of lines or other features that are spaced from each other at approximately the resolution limit of the printer. Developer (,) is applied to the wafer to produce visible images corresponding to the light images. The visible images function as diffraction gratings which reflect light from the wafer. The visible images are inspected optoelectronically or manually. An adjustment error is determined to exist if the visible images appear substantially identical but are uneven or otherwise abnormal.

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San Jose, CA, United States of America

Eric Richard Kent