Apple Inc.

Solfocus, Inc.

Juniper Networks, Inc.

Eric R Prather

Brett W Degner

David H Narajowski

Eugene Antony Whang

Christopher J Stringer

Matthew Phillip Casebolt

Caitlin Elizabeth Kalinowski

Michael D McBroom

Patrick Kessler

Adam Thomas Stagnaro

Jesse T Dybenko

Michael E Leclerc

Jay S Nigen

Daniel Lynn McBroom

Frank Faqiu Liang

Anthony Joseph Aiello

Joshua D Banko

Kevin Scott Fetterman

Jonathan L Berk

Vinh H Diep

Connor Raymond Duke

Arash Naghib Lahouti

Eric J Weirshauser

Reuben J Williams

Clark Everett Waterfall

Daniel L Mcbroom

Houtan R Farahani

Kristopher P Laurent

Bartley K Andre

Daniele De Iuliis

Mikael M Silvanto

Paul Xiaopeng Wang

Adam T Garelli

Christiaan A Ligtenberg

Paul A Baker

Nicholas Alan Rundle

David J Lima

Simon S Lee

Richard D Kosoglow

Peter Ronald Young

Mark K Sin

Bart K Andre

James M Cuseo

Mahesh S Hardikar

Cheng Ping Tan

Danny L McBroom

Ian A Guy

Laura M Campo

Daniel David Hershey

Nicholas Mancini

William K Smith

Mariel L Lanas

Kevin J Ryan

David C Parell

Hing Wah Chan

Philippe P Herrou

Ashkan Rasouli

Steve Horne

Scott J Campbell

Rodrigo Dutervil Mubarak

Mary Jane Hale

Simon J Trivett

Pooja B Patel

Connor R Duke

Michael D Mcbroom

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Computer housing

This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

Structural and thermal management of an integrated circuit

Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

High-capacity computer modules

An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Computer tower architecture thermal management

This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Internal architecture of a computing device

An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference ('EMI') shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

Electronic device with a thermal and EMI shield

Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.

Fan impeller with sections having different blade design geometries

Computer tower architecture and thermal management

Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

Fan flow directing features, systems and methods

An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Thermal flow assembly including integrated fan

An electronic device may be provided with a housing surrounding an interior portion of the electronic device. The housing may have one or more layers of material such as fabric layers, polymer layers, and metal layers. An outer fabric layer may have openings between adjacent strands of material such as openings between adjacent warp and weft strands. An inner housing layer such as a layer of plastic or metal may have openings that define airflow entrance and exit ports. The outer fabric layer may overlap the openings of the airflow entrance and exit ports. A fan may draw cooling air into the interior through the airflow entrance port and may expel air through the airflow exit port. An airflow controller in the interior may be controlled by control circuitry based on measurements from temperature sensors. The airflow controller may steer airflow to cool appropriate electronic components in the interior.

Electronic devices with cooling systems

Growing community of inventors

Santa Clara, CA, United States of America

Eric R Prather