General Electric Company

Eric Patrick Davis

Christopher James Kapusta

Bruno Kristiaan Bernard De Man

Douglas Albagli

William Andrew Hennessy

Biju Jacob

Nicholas Ryan Konkle

Jason Harris Karp

Glenn A Forman

William Robert Ross

Scott Sheridan Smith

The present disclosure relates to the use of X-ray detector cassettes that may be abutted or overlapped to form a detector assembly suitable for imaging objects that are too large to image using a single X-ray detector cassette. Such a detector assembly may be customized in terms of the size and/or shape of the field-of-view (FOV). In certain embodiments the radiation-sensitive electronics (e.g., readout electronics) are positioned to the side of the X-ray detecting components (e.g., scintillator, TFT array, and so forth), allowing the cassette to be thin relative to other detector devices and allowing the electronics to remain outside the X-ray beam path.

Tileable X-ray detector cassettes

An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

Electronic packages and methods of making and using the same

A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.

Flexible embedded sensor arrays and methods of making the same

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Niskayuna, NY, United States of America

Eric Patrick Davis