Robert Boschgmbh

Eric Ochs

Florian Grabmaier

Jay Scott Salmon

Eckart Schellkes

Frieder Haag

Ronny Ludwig

Rainer Straub

Walter Roethlingshoefer

Michael Knauss

Patrick Wellner

Holger Hoefer

Walter Beck

Christoph Ruf

Stephan Henzler

Albert-Andreas Hoebel

Lutz Rauscher

Dietmar Schaible

Andy Doller

Juergen Schwaiger

Detlef Nitsche

Scott Naugle

Bernhard Bachor

Klaus-Peter Dambock

Christian Voehringer

Jay S Salmon

A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.

Cavity package design

An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

Electrical device having a lubricated joint and a method for lubricating such a joint

A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.

MEMS microphone package with molded interconnect device

An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Solder joint inspection

A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element.

Sensor module and method for producing a sensor module

A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

Microphone package and method for manufacturing same

In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Method for producing a conductive coating on an insulating substrate

The present invention relates to an electronic circuit unit having at least one semiconductor (), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections () each have a contact surface () situated on the substrate () which, when the substrate () and the housing () are joined together, comes to lie in an opposing position to the counter-contact surfaces () of the contact paths (). The present invention also relates to a corresponding manufacturing method.

Electronic circuit unit

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Pittsburgh, PA, United States of America

Eric Ochs