Raytheon Company

Eric Miller

Sean P Kilcoyne

Adam M Kennedy

Christian M Boemler

Justin Gordon Adams Wehner

Eric J Beuville

David J Gulbransen

Matthew D Chambers

Jeffery H Burkhart

Andrew E Gin

Drew Fairbanks

Methods and apparatus for an assembly having directly bonded first and second wafers where the assembly includes a backside surface and a front side surface. The first wafer includes IO signal connections vertically routed to the direct bonding interface by a first one of the bonding posts on the first wafer bonded to a first one of the bonding posts on the second wafer. The second wafer includes vertical routing of the IO signal connections from first one though the bonding posts on the second wafer to IO pads on a backside surface of the assembly.

Integrated circuit having vertical routing to bond pads

A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.

Mosaic focal plane array

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Lompoc, CA, United States of America

Eric Miller