Cisco Technology, Inc.

Eric Michael Lotter

Rakesh Bhatia

Hong Huynh

David L Duell

Daniel B Oliver

In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.

Stacked base heat sink with heat pipes in-line with airflow

A computing device comprises an air moving device operable to produce an airflow that removes heat from one or more components that are arranged upstream from the air moving device. The airflow corresponds to an acoustic energy signature. The computing device further comprises one or more mechanical drives that are arranged downstream from the air moving device, and a baffle comprising a first surface and an opposing second surface. The baffle is disposed between the air moving device and the one or more mechanical drives. The baffle defines a plurality of perforations extending between the first surface and the second surface, and the plurality of perforations are dimensioned and arranged to mitigate one or more predefined components of the acoustic energy signature of the airflow while permitting a first portion of the airflow to pass through the baffle to remove heat from the one or more mechanical drives.

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Gilroy, CA, United States of America

Eric Michael Lotter