Hrl Laboratories, LLC

Superconductor Technologies Inc.

Eric M Prophet

Miroslav Micovic

Alexandros Margomenos

Florian G Herrault

Hasan Sharifi

Jongchan Kang

Balam A Willemsen

Genichi Tsuzuki

Melanie Sachiko Yajima

Joel C Wong

George L Matthaei

A method for creating at least one cavity in a semiconductor substrate including the steps of:

Method for creating cavities in silicon carbide and other semiconductor substrates

A microwave electronic component comprising a substrate having top and bottom substrate surfaces; the substrate comprising an aperture between the top and bottom substrate surfaces; a metallic heat sink filling the aperture; a microwave integrated circuit having a top circuit surface with at least one microwave signal port and a bottom circuit surface in contact with the metallic heat sink; a signal line comprising at least a metallic via between the top and bottom substrate surfaces, and a top signal conductor arranged between the microwave signal port and the metallic via; wherein the dimensions and location of the metallic via are chosen such that the metallic via forms, together with the metallic heat sink, a first impedance-matched non-coaxial transmission line.

Impedance-matched through-wafer transition using integrated heat-spreader technology

A method of mounting one or more semiconductor or microelectronic chips, which includes providing a carrier; temporarily adhering the one or more semiconductor or microelectronic chips to the carrier with active faces of the one or more chips facing towards the carrier; providing a package body with at least one chip-receiving opening therein and with at least one contact opening therein; temporarily adhering the package body to the carrier with the at least one opening in the package body accommodating at least a portion of the one or more chips; covering backsides of the one or more chips and filling empty spaces between the one or more chips and walls of the at least one opening in the package body with a metallic material; filling the at least one contact opening with the aforementioned metallic material; wirebonding contacts on the active faces of the one or more chips with contact surfaces in electrical communication with the metallic material in the at least one contact opening; and releasing package body with the one or more chips embedded in the metallic material from the carrier.

Surface mount package for semiconductor devices with embedded heat spreaders

A multi-port active circulator where each of a plurality of FET transistors has (i) a gate connected to an associated port of the multi-port active circulator via a capacitor of an associated one of a plurality of first RF chokes, each of the first RF chokes being connected to a gate of an associated FET transistor of said plurality of transistors, the associated port of said associated FET transistor and to a power supply bias connection; (ii) a source connected to a common point; and (iii) a drain connected to the gate of the same FET transistor by a feedback circuit and connected to the gate of a neighboring FET transistor via a capacitor of one of a plurality of second RF chokes, each of which coupling gates and drains of neighboring FET transistors via capacitors thereof and being connected to another power supply bias connection.

Effective biasing active circulator with RF choke concept

A multi-port active circulator includes a plurality of cascode circuits coupled to one another in a ring. Each respective cascode circuit of the plurality of cascode circuits is coupled to a respective port of a plurality of ports. Each respective cascode circuit includes a common source transistor, a common gate transistor coupled to the common source transistor, and a feedback circuit coupled from the common gate transistor to the common source transistor. Each common source transistor of each respective cascode circuit is coupled to a common junction point.

Active circulator with cascode transistor

A method of forming an E-plane probe includes forming a plurality of monolithically integrated circuits (MICs) on a wafer, each MIC including a monolithic microwave integrated circuit (MMIC), and an E-plane probe coupled to the MMIC, mounting the wafer on an ultra-violet (UV) tape, cutting the wafer with a laser at a first power and a first linear cutting speed along vertical streets and then along horizontal streets to form separate substrates, cutting with the laser at a second power and a second linear cutting speed a rectangle or a portion of a rectangle from the separate substrates to form narrow substrate extensions on the substrates, and repeating this step for each rectangle or portion of a rectangle to be cut to form substrate extensions, and curing the UV tape, wherein the E-plane probes are on the narrow substrate extensions.

E-plane probe with stepped surface profile for high-frequency

A method for forming a wafer level heat spreader includes providing a mesh wafer, the mesh wafer having a plurality of openings and mesh regions between the openings, bonding the mesh wafer to a backside of an integrated circuit (IC) wafer, the IC wafer comprising a plurality of circuits; and electroplating a heat sink material through the plurality of openings and onto to the backside of the IC wafer.

Method of integration of wafer level heat spreaders and backside interconnects on microelectronics  wafers

A narrowband filter comprises an input terminal, an output terminal, and an array of basic resonator structures coupled between the terminals to form a single resonator having a resonant frequency. The resonator array may be arranged in a plurality of columns of basic resonator structures, with each column of basic resonator structures having at least two basic resonator structures. The basic resonator structures in each column may be coupled between the terminals in parallel or in cascade. Two or more resonator arrays may be coupled to generate multi-resonator filter functions.

Zig-zag array resonators for relatively high-power HTS applications

A MEMS switch assembly comprising a substrate and a resilient switching member is provided. The resilient switching member comprises a transverse torsion member having a flexible portion, and a leaf spring and cantilever that extend from the flexible portion of the torsion member. The switching assembly further comprises a first anchoring member mounting the torsion member to the stable structure, and a second anchoring member mounting the leaf spring to the stable structure. In this manner, the leaf spring has a flexible portion between the first and second anchors that can be alternately flexed in opposing directions to deflect the cantilever end in the respective opposing directions. The leaf spring can exhibit a first stable geometry (e.g., a convex geometry) when flexed in one of the opposite directions, and a second stable geometry (e.g., a concave geometry) when flexed in another of the opposite directions. Thus, the switch can be switched between two stable states using a momentary force and can maintain these two stable states without further expenditure of energy.

Spring loaded bi-stable MEMS switch

The present invention alleviates stiction between a suspended beam or microstructure and an underlying substrate by providing a patterned passivation layer on the substrate underneath the beam. The passivation layer is patterned to provide a substrate surface that differs substantially from the bottom surface of the beam. The difference between these two surfaces reduces the potential contact area between the beam and the substrate when the beam is pulled down, thereby reducing adhesive forces between the beam and the substrate and reducing the likelihood of stiction. In one embodiment, the passivation layer is patterned to form a substrate surface comprising a plurality of protuberances. In another embodiment, the passivation layer is patterned to form a substrate surface having a mesh pattern.

Stiction alleviation using passivation layer patterning

The present invention provides an anchor system for securing a MEMS device to a substrate comprising multiple anchors. A MEMS structure, built in accordance with the one embodiment of the invention, comprises a flexible beam suspended over a substrate and a base attached to each end of the beam. Each base is supported above the substrate by multiple anchors attached to the surface of the substrate. Each anchor further comprises anchor legs along its sides that support the base off of the substrate. In one embodiment, the anchors of each base are located away from the interface between the beam and the base. In another embodiment, the lengths of the anchor legs of the anchors are made longer along a direction of good side-wall step coverage than along a direction of poor side-wall step coverage.

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Santa Barbara, CA, United States of America

Eric M Prophet