Micron Technology Incorporated

Eric M Matthews

William C Layer

Mark A Tverdy

Lothar R Kress

An adjustable tray for a semiconductor device, and method of using the tray for handling the device, are provided. Each tray comprises a front frame segment and a back frame segment opposing the front frame segment, and a pair of opposing side frame segments secured to the front and back frame segments to form right angles, each side frame segment containing a longitudinal channel. Each tray further includes a fixed locator segment and an adjustable locator segment, each having a plurality of slots for receiving semiconductor devices therein. The distal ends of the locator segments are secured to the pair of opposing side frame segments at right angles. The adjustable locator segment can be manipulated such that the fixed and adjustable locator segments are spaced apart a distance commensurate with the width of the semiconductor device. The device is friction fit into a slot such that the device is only contacted at keep-out areas on the device. Using stand-offs mounted in stand-off receptacles, two or more trays can be modularly stacked.

Universal memory module/PCB storage, transport, automation handling tray

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM and guides it to a test site. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the associated test contacts. In one embodiment, the test site includes a module locator bar having a first arrangement of alignment pins configured for engagement with a plurality of tooling holes formed in an MCM presented at the test site. The module locator bar may be configured to be replaceable with a second module locator bar having a second, different arrangement of alignment pins such that differently configured MCMs may be accommodated and positively aligned at the test site.

Automated multi-chip module handler and testing system

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts. A particularly suitable magazine for use with the handler is also disclosed, as is a method of module handling.

A magazine for carrying a plurality of multi-chip modules (MCMs) in association with an automated MCM handler for automated module testing. The magazine includes a body defining a plurality of mutually parallel receptacles extending between two opposing body sides, each body side having a different height relative to the height of the receptacles. Each receptacle is separated from an adjacent receptacle by a baffle member. At least one notch ins formed in each baffle member so as to form at least one row of aligned notches extending across and contiguous with each receptacle. The aligned row of notches is configured to receive an elongated element for effectively altering the length of each receptacle. At least one recess is formed in an underside of the magazine and transversely intersects each receptacle. The magazine may also include structure to accommodate vertical stacking of the magazine with a plurality of like magazines.

Magazine for carrying a plurality of multi-chip modules

An automated method of handling multi-chip modules (MCMs) in conjunction with automated module testing. The method includes providing a plurality of MCMs in a magazine at an input location and positively displacing the magazine through an indexing device. At the indexing device, the MCMs are each positively retreived and guided to a test site, tested, and positively ejected for sorting according to the results of the testing. Depending on the testing results, the MCMs may be placed in a shipping tray or in a discard bin. The emptied magazine is further displaced to an output location where it may be stacked with similar emptied magazines.

Automated multi-chip module handler, method of module handling, and module magazine

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts.

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Nampa, ID, United States of America

Eric M Matthews