Deere + Company

Eric M Johnson

Christopher J Schmit

Hema V Guthy

Roman Cisek

Paul Warren Johnson

Jeremy J Wagner

Ali Tayh

Matthew Frank

Darren J Hellman

Michael C Paisley

Kalathur Pattabiraman

John J White

A manufacturing method uses layered slabs to create a final pattern for a mold or for creating the mold itself. The method includes: preparing a desired number of slabs including a first slab and a second slab; machining the first slab; machining the second slab; and after the second slab is coupled to the first slab, repeating the machining step for each additional slab included in the desired number of slabs to form the final pattern or mold.

Layered slab manufacturing system and method

A gear includes an inner portion formed from a first material; an outer portion formed from a second material melted and solidified onto the inner portion; and a plurality of teeth formed in the outer portion after the second material has solidified.

Composite gears and methods of manufacturing such gears

A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.

Package for a semiconductor device

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Geneseo, IL, United States of America

Eric M Johnson