Hewlett-packard Development Company, L.P.

Hewlett-packard Company

Other

Eric Lee Nikkel

Michael G Monroe

Jeffrey Scott Obert

James Richard Przybyla

James McKinnell

Arthur Piehl

Jeremy Harlan Donaldson

Adel Jilani

Kenneth James Faase

Jeffrey R Pollard

Jeff Hess

Stephen Jalrus Potochnik

Chien-Hua Chen

Steven David Leith

Kenneth Michael Kramer

Mickey Szepesi

Devin Alexander Mourey

Dennis M Lazaroff

Bao-Sung Bruce Yeh

Bao Yeh

Michele K Szepesi

Richard P Tomasco

Michael W Cumbie

Andrew L Van Brocklin

Rio Rivas

Charles Craig Haluzak

Silam J Choy

Si-lam Choy

Gary G Lutnesky

Michael John Regan

Martha A Truninger

Colin C Davis

Robert W Shreeve

Bradley D Chung

Sadiq Bengali

Ronald L Enck

Jennifer Wu

Siddhartha Bhowmik

Murali Chaparala

Samson Berhane

Jon A Crabtree

Tracy B Forrest

Sam G Angelos, Jr

James Mckinnell

Tracy S Forrest

Arthur R Piehl

A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

Printhead assembly

An example fluidic micro electromechanical system may include a substrate and a first layer supported by the substrate. The first layer forms sides of a chamber, a passage through one of the sides and a chamber and a check valve leaf. The check valve leaf is pivotable about an axis nonparallel to the substrate to open and close the passage. The system may further include a second layer over the chamber, an opening into the chamber and a resistor supported within the chamber.

Fluidic micro electromechanical system

A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.

Printed circuit board to molded compound interface

In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

A printhead includes a moveable membrane, a piezoelectric actuator to move the membrane, and electronic circuitry disposed on the moveable membrane. A method of fabricating a printhead includes fabricating CMOS circuitry on a first side of a circuit wafer, and forming a chamber in a second side of the circuit wafer such that a bottom of the chamber forms a moveable membrane and the CMOS circuitry is disposed on the moveable membrane opposite the bottom of the chamber. A printing system includes a printhead having CMOS circuitry formed on a first side of a moveable membrane, a chamber having a bottom comprising a second side of the moveable membrane, and a piezoelectric actuator formed over the CMOS circuitry, configured to cause displacement of the moveable membrane into the chamber.

Printhead and related methods and systems

A printing device () including a substrate () having an aperture () extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber () fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.

Printing device

A fluid manifold for a fluid ejection device including a plurality of fluid feed slots includes a first layer and a second layer adjacent the first layer, and a first fluid routing and a second fluid routing each provided through the first layer and the second layer. The fluid ejection device is supported by the second layer, and the first fluid routing is communicated with one of the fluid feed slots, and the second fluid routing is communicated with an adjacent one of the fluid feed slots. A pitch of the first fluid routing and the second fluid routing through the first layer is greater than a pitch of the fluid feed slots, and the first fluid routing and the second fluid routing each include a first channel oriented substantially parallel with the fluid feed slots and a second channel oriented substantially perpendicular to the fluid feed slots.

Fluid manifold for fluid ejection device

Systems, methodologies, and other embodiments associated with a micro-electrical-mechanical system (MEMS) Fabry-Perot interferometric device (FPID) are described. Fabricating a MEMS FPID may include fabricating a pixel plate and a reflector plate so a Fabry-Perot cavity is defined therebetween. Fabrication may include producing a capacitor plate that facilitates electrostatically moving the pixel plate. Fabrication may include producing electrical connections between plates and producing circuitry to control plate voltages to facilitate creating an electrostatic force between plates. The MEMS FPID may include stops fabricated from a conductive material and circuitry for maintaining the stops and plates at an electrical potential that will yield a zero electric field contact event.

Fabry-perot interferometric MEMS electromagnetic wave modulator with zero-electric field

An electronic light modulator device for at least partially displaying a pixel of an image, the device comprising first and second reflectors defining an optical cavity therebetween, the optical cavity being selective of an electromagnetic wavelength at an intensity by optical interference, the device having at least first and second optical states, at least one of the optical states being tunable and the other not tunable.

Light modulator with tunable optical state

Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a structure contains a plurality of slots in a substrate. The structure also has a trench in the substrate contiguous with the plurality of slots to form a compound slot.

Slotted substrates and methods and systems for forming same

Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed.

Piezo resistive pressure sensor

A micro electrical mechanical system (MEMS) pressure sensor includes a base structure defining an opening, a plurality of support members coupled to the base structure, a thin-film diaphragm supported by the support members, and at least one strain-sensitive member associated with the at least one support member.

Micro electrical mechanical systems pressure sensor

A method of forming a slot in a substrate comprises growing an oxide layer on a first side of a substrate, patterning and etching the oxide layer to form an opening, forming a material overlying the opening and the oxide layer, removing substrate material through a second side to a first distance from the first side, and anisotropic etching the substrate to create a substrate opening at the first side which is aligned with the opening in the oxide layer during anisotropic etching. The material overlying the opening and the oxide layer is selected so that an anisotropic etch rate of the substrate at an interface of the material and the substrate is greater than an anisotropic etch rate of the substrate at an interface of the oxide layer and the substrate.

Methods for controlling feature dimensions in crystalline substrates

Various embodiments of a MEMs structure including flexures movably supporting a reflective face are disclosed.

Flexures

An electronic device for at least partially displaying a pixel of an image, the device comprising first and second reflectors defining an optical cavity therebetween, the optical cavity being selective of an electromagnetic wavelength at an intensity by optical interference, the device having a concentric control structure comprising at least an inner and an outermost electrode, the optical cavity being controlled only by the inner electrode.

Light modulator with concentric control-electrode structure

Growing community of inventors

Philomath, OR, United States of America

Eric Lee Nikkel