Other

Galahad, Co.

Dek International Gmbh

Eric Lee Hertz

Allen David Hertz

Dennis D Epp

Anthony A Imm

J Stephen Wiggs

A safety light system integrated into a vehicle. The safety light system includes a safety light assembly receptacle carried by a body panel of a vehicle. The safety light assembly receptacle includes a light assembly receiving cavity for receiving and temporarily retaining a removable light assembly. The removable light assembly includes elements to provide a user controlled continuous red light, a flashing red light, and a continuous white light. The flashing red light provides a roadside flare configuration. The continuous white light provides a flashlight configuration. The continuous red light in conjunction with the flashing red light configuration provides a driving light configuration. The removable light assembly can include a securing mechanism for attaching the removable light assembly to an object to warn others of the extended object and/or support legs enabling operation as a roadside flare, spotlight, and the like.

Detachable vehicle taillight and flashlight combination

A safety light system comprising a trailer hitch mounted configuration. The safety light system includes a safety light assembly receptacle carried by a trailer hitch mounting member. The safety light assembly receptacle includes a light assembly receiving cavity for receiving and temporarily retaining a removable light assembly. The removable light assembly includes elements to provide a user controlled continuous red light, a flashing red light, and a continuous white light. The flashing red light provides a roadside flare configuration. The continuous white light provides a flashlight configuration. The continuous red light in conjunction with the flashing red light configuration provides a driving light configuration. The removable light assembly can include a securing mechanism for attaching the removable light assembly to an object to warn others of the extended object and/or support legs enabling operation as a roadside flare, spotlight, and the like.

Trailer hitch receiver safety light system

A safety light system is incorporated into the tailgate of a pickup truck. The safety light is incorporated into the tailgate and is illuminated when the tailgate is in a lowered or horizontal position and when either the ignition switch is in the on position, the parking lights are turned on, or both. The safety light can be positioned either on the top edge-rail of the tailgate, as a slide-out unit placed in a pocket with the top edge-rail of the tailgate, or as a rotating assembly incorporated into the outer sheet metal of the tailgate. Additional safety lights can be incorporated into the sides of the tailgate assembly. An optional feature includes the ability to pull the safety light out from the tailgate and secure the safety light to an object that extends beyond the length of the pickup bed. Alternatively, the safety lights can be installed in or on a bed extension apparatus. The safety light can additionally include the features of a standard taillight, comprising brake lights and or turn signal indicators. Alternates include reflective tape and a pullout feature from other locations. A pullout section can also provide a step for accessing the bed.

Pickup truck tailgate safety light system

A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc. The same technology may be applied to other cleaning processes for cleaning Printed Circuit Assemblies, tooling, and the like, whereby the cleaning processes can assist in cleaning within the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat.

Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's

A method is disclosed for maintaining a reliable operation of a flexible, self-conforming support system. The self-conforming support system utilizes a plurality of pins that move vertically within a series of apertures. The motion of the pins can be hindered with unwarranted material becoming lodged between the pins and the respective aperture. One scenario where this is highly probable is when using the self-conforming support system for supporting Printed Circuit Boards during a solder paste application process. The present invention utilizes a protective collar to deflect any excess solder paste from becoming lodged between any of the pins and the respective aperture. The collar is essentially an umbrella, and can be of a molded material, a pliant material, or machined into the pins. The collar can further include a pliant top which also protects the Printed Circuit Board from the pins.

Method for maintaining operability of a flexible, self conforming, workpiece support system

An apparatus and accessories are disclosed for a flexible support apparatus using elongated support members to support a face of a workpiece and respective protrusions . The elongated support members are arranged through at least one plane of perforated material , where the elongated support members are profiled against the workpiece and respective protrusions . The profile of the elongated support members is created by contacting forces generated by bringing the workpiece and the plurality of elongated support members together. A holding force is then applied to the elongated support members to support the workpiece against forces applied by a workstation. Fluid is used to raise expansion members to raise the plurality of elongate support members . A perforated plate is used to control the flow of fluid between a fluid cavity and the plurality of expansion members . Accessories to improve performance and reliability include a protective collar for protection from foreign materials (solder paste) and a reinforcing member to reinforce thin, flexible workpieces

Method for ensuring planarity when using a flexible, self conforming, workpiece support system

Flexible, self conforming, workpiece support system and accessories

A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

Method for acoustic and vibrational energy for assisted drying of solder stencils and electronic modules

A method and apparatus are disclosed for placing solder balls on electronic pads or on a component or substrate such as for a ball grid array (BGA) applicator The solder balls are held to openings in a foil against a second layer by a holding force, whereby the second layer is of a porous material and laminated to the foil One such holding force can be a vacuum force applied to the solder balls through the openings in a foil After locating the solder balls at electronic pads or on a component or substrate by removing the holding force the solder balls are released and placed on the electronic pads Optionally, a plurality of pins may provide a releasing and/or placing force.

Method and apparatus using laminated foils for placing conductive preforms

A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.

Method and apparatus for acoustic pressure assisted wave soldering

A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms on a respective pattern of electronic pads on a receiving substrate for such uses as a Ball Grid Array component . The release mechanisms are of either compliant mechanical vibratory air pressure or , or sound pressure waves . Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Method and apparatus for release and optional inspection for conductive preforms placement apparatus

A method and apparatus are disclosed for a flexible support system using elongated support members to support a face of a module. The flexible support member(s) are arranged through a primary member with apertures, where the elongated support members are automatically returned to a home position by a self restoring mechanism, the position of the elongated support members are adjusted by the contacting forces applied by bringing the module and the flexible support apparatus together, then applying a clamping force to secure the elongated support members where the elongated support members can sustain the loads applied onto a module during an assembly process.

Method and apparatus for self-conforming support system

A method and apparatus are disclosed for placing solder balls on electronic pads on a component or substrate, such as for a ball grid array (BGA) applicator. The BGA applicator utilizes a foil(s) that is treated to provide color to the surface; the color is used to assist in inspection of the solder spheres. The solder balls can transferred to the electronic pads by holding them to openings in the foil by applying a holding force such as a vacuum applied to the solder balls through the openings in a foil. Optionally, a second material can be placed against the foil where the secondary material holds solder spheres to the apertures. After locating the solder balls to the electronic pads of a component or substrate, the solder balls are released and placed on the electronic pads by removing the holding force such as by deactivating the vacuum.

Method and apparatus using colored foils for placing conductive preforms

A method and apparatus are disclosed for placing solder balls,on electronic pads,on a substrate,such as for a ball grid array (BGA) applicator,The solder balls,are held to openings,in a foil,such as by vacuum force,applied to the solder balls,through the openings,in a foil,After locating the solder balls,at electronic pads,on a substrate,by deactivating the vacuum force,and optionally applying a release force,the solder balls,are released and placed on the electronic pads,Optionally, a release mechanism,applies placing force,to the solder balls,through the openings,in the foil

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Boca Raton, FL, United States of America

Eric Lee Hertz