Apple Inc.

Applied Materials, Inc.

Eric Lee Benson

Victor H Yin

Jun Qi

Dinesh C Mathew

Bryan W Posner

Mingxia Gu

Robert Y Cao

Xinyu Zhu

Zhenyue Luo

Meizi Jiao

Chungjae Lee

Morteza Amoorezaei

Keith J Hendren

Adam T Garelli

Christiaan A Ligtenberg

Joshua A Spechler

Mengyang Liang

Rong Liu

Edward J Cooper

Ari P Miller

Ziruo Hong

Christopher L Boitnott

Yanming Li

Ian A Guy

Erik A Zweigle

Youchul Jeong

Xiang Fang

Francesco Ferretti

Eric N Vergo

Michael C Sulkis

Michael J Lee

Sunitha Chandra

Marianna C Sbordone

Seth G McFarland

Jie Xiang

Mary M Morrison

Terence Chan

Paul Xiaopeng Wang

Nicholas Alan Rundle

Wey-Jiun Lin

Simon S Lee

Yu P Sun

David Phillip Tarkington

Tingjun Xu

Chenhua You

Jeffrey S Sullivan

Jason N Gomez

Lauren M Farrell

Ling Han

Wei He

Qingbing Wang

Victor Hao-En Yin

Robert J Durand

Kwonil D Fleischman

Brian P Graves

Wr Jamarulan Wr Ramli

Valerie S Chang

Danny Cam Lu

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.

Display modules with direct-lit backlight units

Direct-lit backlight units with light-emitting diodes

A display may include a color filter layer, a liquid crystal layer, and a thin-film transistor layer. A camera window may be formed in the display to accommodate a camera. The camera window may be formed by creating a notch in the thin-film transistor layer that extends inwardly from the edge of the thin-film transistor layer. The notch may be formed by scribing the thin-film transistor layer around the notch location and breaking away a portion of the thin-film transistor layer. A camera window may also be formed by grinding a hole in the display. The hole may penetrate partway into the thin-film transistor layer, may penetrate through the transistor layer but not into the color filter layer, or may pass through the thin-film transistor layer and partly into the color filter layer.

Displays with camera window openings

Direct-lit backlight units with optical films

An electronic device can include a housing that at least partially defines an exterior surface and an internal volume of the electronic device, and a display assembly at least partially disposed in the internal volume. The display assembly can include a transparent cover that at least partially defines the exterior surface of the electronic device, a backlight unit disposed between the cover and the housing, a frame coupling the cover to the backlight unit, a portion of the frame at least partially defining an aperture, and an electronic component disposed in the internal volume and extending through the aperture.

Electronic device display assembly

An electronic device such as a laptop computer or other device may have a housing. A display may be coupled to the housing. The display may have a pixel array configured to display an image. Backlight illumination for the pixel array may be provide by a backlight unit. The backlight unit may have a light guide layer. A light source may provide light to an edge of the light guide layer. The light guide layer may scatter the light outwardly to serve as the backlight illumination for the pixel array. The backlight unit may have optical films interposed between the light guide layer and the pixel array. The optical films may include flexible polymer layers such as diffuser layers and prism films. The optical films may each have a bent alignment portion that bends back on itself while wrapping around an edge of the light guide layer.

Display having optical films with bent alignment structures

An electronic device may have a display with a backlight. The backlight provides backlight illumination for an array of pixels that is displaying images. The backlight may include an array of cells. Each cell may contain a light source with one or more light-emitting diodes and a cavity reflector that reflects light from the light source outwardly through a diffuser for use in forming the backlight illumination. The light sources may be mounted to a printed circuit. Support posts on the printed circuit may be used to maintain the diffuser at a fixed distance from the printed circuit. The support posts may have opposing first and second ends. The first ends may be attached to the diffuser with fixed connections such as adhesive connections. The second ends may be attached to the printed circuit using floating connections.

Backlight units with support posts and cavity height monitoring

An electronic device may have a housing with a lid that rotates relative to a base. A display in the lid may have a thin-film transistor layer. Display driver circuitry may be mounted to the thin-film transistor layer. A display timing controller integrated circuit may be mounted in the base. A rigid flex printed circuit may have a rigid portion in the base to which the display timing controller integrated circuit is mounted and may have a rigid portion in the lid. A flexible printed circuit portion of the rigid flex printed circuit may be used to couple the rigid printed circuit portion in the lid to the thin-film transistor layer. A flexible printed circuit portion of the rigid flex printed circuit that extends between the lid and the base may be formed from a double-shield-layer single-signal-line-layer flexible printed circuit.

Hinged portable electronic device with display circuitry located in base

The described embodiments relate generally to liquid crystal displays (LCDs), and more particularly to methods for extending a glass portion of a display to an edge of a display housing. In one embodiment, a thin cover glass layer is provided between a color filter glass layer and an upper polarizer. The thin cover glass layer is supported along an edge of the display by a filler material that can include a foam dam and a glass spacer or adhesive filler. The filler material allows the cover glass layer to be supported without damaging any drivers or circuits located on an underlying thin film transistor glass layer. In another embodiment, a glass spacer circuit with integrated drivers and circuitry on its lower surface can support the cover glass along the edge of the display.

Method to design the integrated full coverage LCD module cover glass

An electronic device may have a housing. Electrical components such as a display and other circuitry may be mounted in the housing. The housing may have portions that move with respect to each other such as a lid that rotates relative to a base. A flexible printed circuit may have metal lines that couple components in one portion of the housing to components in another portion of the housing. As the housing portions move with respect to each other, the flexible printed circuit bends. Reliability may be enhanced for the flexible printed circuit by providing the metal layer that forms the metal lines with upper and lower coating layers. The coating layers may be formed from metal with a higher Young's modulus than a metal core in the metal layer. A slot may be formed along the length of the flexible printed circuit to help increase the minimum bend radius exhibited by the flexible printed circuit. Upper and lower metal shield layers may be provided above and below the metal traces.

Flexible cables in electronic devices with moving components

The present invention generally relates to a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved.

Solder bonding method and apparatus

Growing community of inventors

San Francisco, CA, United States of America

Eric Lee Benson